Patent classifications
C22F1/16
PROCESS FOR MANUFACTURING A THIN STRIP MADE OF SOFT MAGNETIC ALLOY AND STRIP OBTAINED
Method for manufacturing a thin strip in a soft magnetic alloy and strip obtained A method for manufacturing a strip in a soft magnetic alloy capable of being cut out mechanically, the chemical composition of which comprises by weight:
TABLE-US-00001 18% Co 55% 0% V + W 3% 0% Cr 3% 0% Si 3% 0% Nb 0.5% 0% B 0.05% 0% C 0.1% 0% Zr + Ta 0.5% 0% Ni 5% 0% Mn 2%
The remainder being iron and impurities resulting from the elaboration, according to which a strip obtained by hot rolling is cold-rolled in order to obtain a cold-rolled strip with a thickness of less than 0.6 mm.
After cold rolling, a continuous annealing treatment is carried out by passing into a continuous oven, at a temperature comprised between the order/disorder transition temperature of the alloy and the onset temperature of ferritic/austenitic transformation of the alloy, followed by rapid cooling down to a temperature below 200 C. Strip obtained.
Austenitic Heat Resistant Alloy and Method for Producing Same
Provided is an austenitic heat resistant alloy having a chemical composition consisting of, in mass %: C: 0.02 to 0.12%; Si: 2.0% or less; Mn: 3.0% or less; P: 0.030% or less; S: 0.015% or less; Cr: 20.0% or more and less than 28.0%; Ni: more than 35.0% and 55.0% or less; Co: 0 to 20.0%; W: 4.0 to 10.0%; Ti: 0.01 to 0.50%; Nb: 0.01 to 1.0%; Mo: less than 0.50%; Cu: less than 0.50%; Al: 0.30% or less; N: less than 0.10%; Mg: 0 to 0.05%; Ca: 0 to 0.05%; REM: 0 to 0.50%; V: 0 to 1.5%; B: 0 to 0.01%; Zr: 0 to 0.10%; Hf: 0 to 1.0%; Ta: 0 to 8.0%; Re: 0 to 8.0%; and the balance: Fe and impurities, wherein a shortest distance from a center portion to an outer surface portion of a cross section of the alloy is 40 mm or more, the cross section being perpendicular to a longitudinal direction of the alloy, an austenite grain size number at the outer surface portion is 2.0 to 4.0, an amount of Cr which is present as a precipitate satisfies [Cr.sub.PB/Cr.sub.PS10.0], and [YS.sub.S/YS.sub.B1.5] and [TS.sub.S/TS.sub.B1.2] are satisfied at a normal temperature.
Austenitic Heat Resistant Alloy and Method for Producing Same
Provided is an austenitic heat resistant alloy having a chemical composition consisting of, in mass %: C: 0.02 to 0.12%; Si: 2.0% or less; Mn: 3.0% or less; P: 0.030% or less; S: 0.015% or less; Cr: 20.0% or more and less than 28.0%; Ni: more than 35.0% and 55.0% or less; Co: 0 to 20.0%; W: 4.0 to 10.0%; Ti: 0.01 to 0.50%; Nb: 0.01 to 1.0%; Mo: less than 0.50%; Cu: less than 0.50%; Al: 0.30% or less; N: less than 0.10%; Mg: 0 to 0.05%; Ca: 0 to 0.05%; REM: 0 to 0.50%; V: 0 to 1.5%; B: 0 to 0.01%; Zr: 0 to 0.10%; Hf: 0 to 1.0%; Ta: 0 to 8.0%; Re: 0 to 8.0%; and the balance: Fe and impurities, wherein a shortest distance from a center portion to an outer surface portion of a cross section of the alloy is 40 mm or more, the cross section being perpendicular to a longitudinal direction of the alloy, an austenite grain size number at the outer surface portion is 2.0 to 4.0, an amount of Cr which is present as a precipitate satisfies [Cr.sub.PB/Cr.sub.PS10.0], and [YS.sub.S/YS.sub.B1.5] and [TS.sub.S/TS.sub.B1.2] are satisfied at a normal temperature.
Lead-free solder compositions
A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
Lead-free solder compositions
A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
HIGH ENTROPY ALLOY STRUCTURE AND A METHOD OF PREPATING THE SAME
A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy with eutectic microstructure therein; and subjecting the bulk alloy to an acidic condition to form a bulk porous structure with eutectic microstructure therein. A high entropy alloy structure is also provided as prepared by the method.
HIGH ENTROPY ALLOY STRUCTURE AND A METHOD OF PREPATING THE SAME
A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy with eutectic microstructure therein; and subjecting the bulk alloy to an acidic condition to form a bulk porous structure with eutectic microstructure therein. A high entropy alloy structure is also provided as prepared by the method.
High Entropy Alloy Having Composite Microstructure and Method of Manufacturing the Same
A method of making a metallic alloy, more particularly, a high-entropy alloy with a composite structure that exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.
High Entropy Alloy Having Composite Microstructure and Method of Manufacturing the Same
A method of making a metallic alloy, more particularly, a high-entropy alloy with a composite structure that exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.
ADDITIVE MANUFACTURING OF ARTICLES COMPRISING BERYLLIUM
A method of making an article includes depositing a plurality of layers to form a three-dimensional preform, sintering the preform to form a sintered preform, and infiltrating the preform with at least one metal to form the article. At least one layer of the plurality of layers is formed from a beryllium-containing composition including beryllium powder. The infiltrating metal can be selected from aluminum and magnesium.