C23C8/40

PROCESS OF ELIMINATING FRICTION AND INCREASING STRUCTURAL HARDNESS AND DURABILITY AND INCREASING LONGEVITY IN THE FABRICATION OF METALLIC STRUCTURES
20190249941 · 2019-08-15 ·

A process of eliminating friction and increasing structural hardness and durability and increasing longevity in the fabrication of metallic structures including at least one mechanical machining device with at least one cutting device, at least one element of material stock, and a reactionary lubricant, the process having the steps of placing the material stock on the working surface of a mechanical machining device, initiating the machining device wherein a cutting device will spin and be used to shape a firearm component, adding the reactionary lubricant to both the spinning drill bit engaged in shaping the firearm component and the firearm component's surface, and by an in situ chemical formation process the firearm component will obtain a layer of graphene formed through the friction, heat, and pressure bearing on spinning drill bit and firearm component surface, reducing the asperities in the material of the firearm component as the component is machined.

Methods of treating metal surfaces and devices formed thereby

The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

Methods of treating metal surfaces and devices formed thereby

The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

PROCESS FOR THE PREPARATION OF HALIDE PEROVSKITE AND PEROVSKITE-RELATED MATERIALS

This invention is related to a method for the preparation of halide perovskite or perovskite-related materials on a substrate and to optoelectronic devices and photovoltaic cells comprising the perovskites prepared by the methods of this invention The method for the preparation of the perovskite includes a direct conversion of elemental metal or metal alloy to halide perovskite or perovskite-related materials.

Method for boriding of coatings using high speed electrolytic process

A method for producing a wear and corrosion resistant WC based material coated with one or more metals selected from group IVB, VB and VIB metals (according to CAS system) and Al is disclosed. The method comprises treating of said coated structure with electrochemical boriding treatment in an electrolyte which is substantially free of halogenated compounds wherein the electrolyte comprises alkali carbonates and boron sources and said electrolyte being heated during electrolysis under an induction heating regime having electromagnetic frequency ranging from 50 to 300 kHz during electrolysis.

Method for boriding of coatings using high speed electrolytic process

A method for producing a wear and corrosion resistant WC based material coated with one or more metals selected from group IVB, VB and VIB metals (according to CAS system) and Al is disclosed. The method comprises treating of said coated structure with electrochemical boriding treatment in an electrolyte which is substantially free of halogenated compounds wherein the electrolyte comprises alkali carbonates and boron sources and said electrolyte being heated during electrolysis under an induction heating regime having electromagnetic frequency ranging from 50 to 300 kHz during electrolysis.

Method for inspecting and processing high hardness alloy steels

A highly reactive conversion coating chemistry is used during CAVF processing of high hardness steel alloys such as AMS 6509 and AMS 6517 steel alloys. This chemistry produces a hard, thin, black conversion coating that is not fully rubbed off by the media during the CAVF process. Distressed material regions on the surface of the alloys are not susceptible to forming the conversion coating and remain white. Visual inspection for the presence of such regions is facilitated.

Method for inspecting and processing high hardness alloy steels

A highly reactive conversion coating chemistry is used during CAVF processing of high hardness steel alloys such as AMS 6509 and AMS 6517 steel alloys. This chemistry produces a hard, thin, black conversion coating that is not fully rubbed off by the media during the CAVF process. Distressed material regions on the surface of the alloys are not susceptible to forming the conversion coating and remain white. Visual inspection for the presence of such regions is facilitated.

Pretreating zinc surfaces prior to a passivating process

The invention relates to a wet-chemical pretreatment of zinc surfaces prior to applying a corrosion-protection coating, which deposits a thin inorganic coating of oxide and/or metallic iron. An iron layer structure which is applied according to the invention, hereinafter referred to as ferrization, improves the achievable corrosion protection of wet-chemical conversion coatings on zinc surfaces. Furthermore, the ferrization process causes both a reduction of the contact corrosion of joined metal components which have zinc and iron surfaces as well as a reduction of corrosive coating migration on cut edges of galvanized steel strips with coating layer structures. In particular, the invention relates to an alkaline composition containing an iron ion source, a reducing agent based on oxoacids of nitrogen and phosphorus, and water-soluble organic carboxylic acids with an amino group at the , , or position with respect to the acid group and/or the water-soluble salts thereof.

Pretreating zinc surfaces prior to a passivating process

The invention relates to a wet-chemical pretreatment of zinc surfaces prior to applying a corrosion-protection coating, which deposits a thin inorganic coating of oxide and/or metallic iron. An iron layer structure which is applied according to the invention, hereinafter referred to as ferrization, improves the achievable corrosion protection of wet-chemical conversion coatings on zinc surfaces. Furthermore, the ferrization process causes both a reduction of the contact corrosion of joined metal components which have zinc and iron surfaces as well as a reduction of corrosive coating migration on cut edges of galvanized steel strips with coating layer structures. In particular, the invention relates to an alkaline composition containing an iron ion source, a reducing agent based on oxoacids of nitrogen and phosphorus, and water-soluble organic carboxylic acids with an amino group at the , , or position with respect to the acid group and/or the water-soluble salts thereof.