Patent classifications
C23C14/04
Metal plate
The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than −10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.
Use of a component in a composition, composition for laser transfer printing, and laser transfer printing method
Use of a laser-activatable component in a composition and/or use of a composition that includes the laser-activatable component, during laser transfer printing, characterized in that the laser-activatable component is activated by laser irradiation during use in such a way that the viscosity and/or the elasticity and/or the tack of the composition increase(s) due to an increase in temperature of the composition, wherein the laser-activatable component is a polymer made up of the groups comprising polyethylene glycol, polyvinylpyrrolidone, polyvinyl acetate, polyvinyl alcohol, polyacrylate, polyester, or copolymers of these polymers or blends.
Masks and display devices
The mask includes an evaporation surface and a glass surface facing away from the evaporation surface. The mask is provided with a plurality of evaporation holes distributed in an array. The evaporation hole penetrates the evaporation surface and the glass surface, and the evaporation hole includes a first opening on the evaporation surface and a second opening on the glass surface. An orthographic projection of the first opening on the glass surface is a first projection opening, and the first projection opening covers the second opening. An interval between the first projection opening and the second opening in a first direction of tensioning the mask is a first interval. An interval between the first projection opening and the second opening in a second direction perpendicular to the first direction is a second interval. The second interval is less than the first interval.
Additively manufactured shadow masks for material deposition control
A shadow mask for a substrate is disclosed. The shadow mask includes a frame circumscribing a surface of the substrate. The shadow mask further includes one or more island mask features within the surface of the substrate, configured to block a deposition of a material onto at least a portion of the surface of the substrate. The shadow mask further includes one or more crossbeams coupling one or more island mask features to the frame at an elevation relative to the substrate. The one or more cross beams are configured to permit deposition of a material onto the substrate surface underneath the one or more crossbeams. In some instances, the shadow mask is manufactured through an additive manufacturing process.
Mask and method of manufacturing the same
A mask includes a first mask that includes a first long side that extends in a first direction and a first short side that extends in a second direction that crosses the first direction and that includes a first edge portion, a first center portion, and a first welded portion, that are sequentially arranged in the first direction. The mask further includes a second mask that includes a second long side that extends in the first direction and a second short side that extends in the second direction and that includes a second welded portion, a second center portion, and a second edge portion, that are sequentially arranged in the first direction. The first welded portion is in contact with the second welded portion.
Manufacturing device for mask unit
A manufacturing device for mask unit having a mask frame and a mask fixed to the mask frame includes a stage including a frame holding stage, and an alignment stage arranged with a plurality of lift-pins, a holding part for holding a reference plate arranged facing the stage, a mask holding unit, the mask holding unit being arranged between the stage and the reference plate, and a camera for imaging a direction of the stage passing through the reference plate, wherein the mask holding unit holds the mask at a surface on the frame side, the mask holding unit rises and falls above the alignment stage by the plurality of the lift-pins, the plurality of lift-pins includes a plurality of first lift-pins capable of contacting the mask holding unit, and the camera images a first reference marker on the mask and a second reference marker on the reference plate.
Display panel, method for preparing display panel, and display device
The disclosure provides a display panel, a method for preparing the display panel, and a display device. The display panel includes: a driving backplane, wherein the driving backplane comprises a display area, the display area is provided with a heterotypic edge, and the display area comprises a plurality of first pixel opening areas and a plurality of second pixel opening areas; wherein the plurality of first pixel opening areas are close to the heterotypic edge, and the plurality of second pixel opening areas are away from the heterotypic edge; and a light emitting structure, wherein the light emitting structure is arranged on the driving backplane and comprises a first functional layer, wherein each of the second pixel opening areas is completely covered by the first functional layer, and each of the first pixel opening areas is partially covered by the first functional layer.
Interconnect structure for semiconductor device and methods of fabrication thereof
Methods and devices for forming a conductive line disposed over a substrate. A first dielectric layer is disposed over the substrate and coplanar with the conductive line. A second dielectric layer disposed over the conductive line and a third dielectric layer disposed over the first dielectric layer. A via extends through the second dielectric layer and is coupled to the conductive line. The second dielectric layer and the third dielectric layer are coplanar and the second and third dielectric layers have a different composition. In some embodiments, the second dielectric layer is selectively deposited on the conductive line.
Interconnect structure for semiconductor device and methods of fabrication thereof
Methods and devices for forming a conductive line disposed over a substrate. A first dielectric layer is disposed over the substrate and coplanar with the conductive line. A second dielectric layer disposed over the conductive line and a third dielectric layer disposed over the first dielectric layer. A via extends through the second dielectric layer and is coupled to the conductive line. The second dielectric layer and the third dielectric layer are coplanar and the second and third dielectric layers have a different composition. In some embodiments, the second dielectric layer is selectively deposited on the conductive line.
Deposition mask apparatus, mask support mechanism, and production method for deposition mask apparatus
A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.