Patent classifications
C23C14/06
Biosensor electrodes prepared by physical vapor deposition
A biosensor component is provided that provides enhanced characteristics for use in biosensors, such as blood glucose sensors. The biosensor component comprises a substrate, a conductive layer deposited on the substrate, and a resistive material layer deposited on the conductive layer. The conductive layer includes nickel, chromium, and iron, such that a combined weight percent of the nickel and chromium in the conductive layer is in the range of 25 to less than 95 weight percent, the weight percent of nickel in the conductive layer is at least 4 weight percent, the weight percent of chromium in the conductive layer is at least 10 weight percent, the weight percent of iron in the conductive layer at least 2 weight percent, and such that the conductive layer comprises 0 to 20 weight percent molybdenum.
Method Of Forming A Halide-Containing Perovskite Film
A hybrid halide perovskite film and methods of forming a hybrid halide perovskite film on a substrate are described. The film is formed on the substrate by depositing an organic solution on a substrate, heating the substrate and the organic solution to form an organic layer on the substrate, depositing an inorganic layer on the organic layer, and heating the substrate having the inorganic layer thereon to form a hybrid halide perovskite film. In some embodiments, the hybrid halide perovskite film comprises a CH[NH.sub.2].sub.2.sup.+MX.sub.3 compound, where M is selected from the group consisting of Sn, Pb, Bi, Mg and Mn, and where X is selected from the group consisting of I, Br and Cl. In other embodiments, the hybrid halide perovskite film comprises a FAMX.sub.3 compound. Methods of forming a piezoelectric device are also disclosed.
High-performance wafer-level lead sulfide near infrared photosensitive thin film and preparation method thereof
Provided are a method for preparing a high-performance wafer-level lead sulfide near infrared photosensitive thin film. Firstly, a surface of the selected substrate material is cleaned; next, a vaporized oxidant is introduced into a vacuum evaporation chamber under a high background vacuum degree, and a PbS thin film is deposited on the clean substrate surface to obtain a microstructure with medium particle, loose structure and consistent orientation. Finally, under a given temperature and pressure, a high-performance wafer-level PbS photosensitive thin film is obtained by sensitizing the film prepared at step S2 using iodine vapor carried by a carrier gas. This preparation method is simple, low-cost and repeatable. The PbS photosensitive thin film has a high photoelectric detection rate. The 600K blackbody room temperature peak detection rate is >8×1010 Jones. The corresponding non-uniformity in a wafer-level photosensitive surface is <5%, satisfying the requirements of preparation of a PbS Mega-pixel-level array imaging system.
Integrated surface treatments and coatings for artificial lift pump components
Artificial lift pump components such as couplings are disclosed, all having a body formed from a selected material, the body having an inner diameter and an outer diameter, a first surface treatment introducing carbon, nitrogen, boron into the material to form a first and hard layer, and a second layer defined as an deposited coating to the first layer that is also made of a carbon, nitrogen, or boron and is further characterized as being ceramic like (hard) and having a low-friction.
Component for fuel injector and method for coating the same
Disclosed are a component for a fuel injector and a method for coating the same. The component for the fuel injector may include a base material, a bonding layer laminated on the base material, a support layer laminated on the outer surface of the bonding layer, and an NbSiCN functional layer including an NbCN layer and an SiCN layer and alternately laminated on the outer surface of the support layer, thereby reducing friction, high hardness, shock resistance, heat resistance, and durability of the component for the fuel injector.
Coated cutting tool
A coated cutting tool comprises a substrate and a coating layer formed on a surface of the substrate, and has a rake face and a flank. The coating layer comprises an alternating laminate structure in which first compound layers containing AlN and second compound layers containing a compound are laminated in an alternating manner, the compound having a composition represented by formula (1) below:
(Ti.sub.1-xAl.sub.x)N (1)
(wherein x satisfies 0.40≤x≤0.70). An average thickness T.sub.1 per first compound layer is 5 nm or more to 160 nm or less, and an average thickness T.sub.2 per second compound layer is 8 nm or more to 200 nm or less. A ratio of T.sub.1 to T.sub.2 is 0.10 or more to 0.80 or less. An average thickness T.sub.3 of the alternating laminate structure is 2.5 μm or more to 7.0 μm or less. A ratio (H/E) of hardness H to elastic modulus E is 0.065 or more to 0.085 or less at the rake face or the flank.
SELF-LUBRICATING FILM OVER WIDE TEMPERATURE RANGES IN VACUUM AND PREPARATION METHOD AND USE THEREOF
The present disclosure belongs to the technical field of functional films, and in particular relates to a self-lubricating film over wide temperature ranges in vacuum and a preparation method and use thereof. The present disclosure provides a self-lubricating film over wide temperature ranges in vacuum, including: a bonding layer, a transition layer and a lubricating layer laminated in sequence, wherein the bonding layer has a chemical composition of Ti; the transition layer has a chemical composition of Ti and TiB.sub.2; the lubricating layer has a chemical composition of Ti, TiB.sub.2 and MoS.sub.2. In the present disclosure, when the self-lubricating films over wide temperature ranges in vacuum are exposed to different temperatures, different components of Ti, TiB.sub.2 and MoS.sub.2 in the films may be correspondingly excited to enrich in frictional contact areas. The composition of each layer synergistically exerts a lubricating effect and improves the tribological properties and stability of the self-lubricating film over wide temperature ranges in vacuum in a vacuum over a wide temperature range.
SYSTEMS AND METHODS FOR PHYSICAL VAPOR DEPOSITION OF SILICON NITRIDE COATINGS HAVING ANTIMICROBIAL AND OSTEOGENIC ENHANCEMENTS
Disclosed herein are systems and methods for physical vapor deposition silicon nitride coatings. The methods thereof may include a creating a magnetically confined plasma near a surface of a silicon nitride. The plasma may cause positively charged energetic ions from the plasma to collide with negatively charged silicon nitride atoms, causing the silicon nitride atoms to be sputtered and deposited on a substrate such as titanium. The silicon nitride coating may be nitrogen-rich silicon nitride or silicon-rich silicon nitride.
MASS AIRFLOW SENSOR AND HYDROCARBON TRAP COMBINATION
A combined mass airflow sensor and hydrocarbon trap is provided for absorbing evaporative hydrocarbon emissions from an air intake duct of an internal combustion engine. The combined mass airflow sensor and hydrocarbon trap comprises a duct that supports a hydrocarbon absorbing sheet in an unfolded configuration within a housing. The duct communicates an airstream from an air filter to the air intake duct during operation of the internal combustion engine. An opening in the housing receives a mass airflow sensor into the duct, such that the mass airflow sensor is disposed within the airstream. Guide vanes extending across the duct reduce air turbulence within the airstream passing by the mass airflow sensor. Ports disposed along the duct allow the evaporative hydrocarbon emissions to be drawn into the interior and arrested by the hydrocarbon absorbing sheet when the internal combustion engine is not operating.
Handling For High Resistivity Substrates
A method of modifying a high-resistivity substrate so that the substrate may be electrostatically clamped to a chuck is disclosed. The bottom surface is implanted with a resistivity-reducing species. In this way, resistivity of the bottom surface of the substrate may be greatly reduced. In some embodiments, to implant the bottom surface, a coating is applied to the top surface. After application of the coating, the substrate is flipped so that the front surface contacts the top surface of the chuck.
The ions are then implanted into the exposed bottom surface to create the low resistivity layer. The resistivity of the low resistivity layer proximate the bottom surface after implant may be less than 1000 ohm-cm. Once the bottom surface has been implanted, the substrate may be processed conventionally. The low resistivity layer may later be removed by wafer backside thinning processes.