A method of making a light weight housing for an internal component is provided. The method including the steps of: forming a first metallic foam core into a desired configuration; forming a second metallic foam core into a desired configuration; inserting an internal component into the first metallic foam core; placing the second metallic foam adjacent to the first metallic core in order to secure the internal component between the first metallic foam core and the second metallic foam core; and applying an external metallic shell to an exterior surface of the first metallic foam core and the second metallic foam core.

A method of making a light weight component is provided. The method including the steps of: forming a metallic foam core into a desired configuration; and applying an external metallic shell to an exterior surface of the metallic foam core after it has been formed into the desired configuration.

A method of making a light weight component is provided. The method including the steps of: forming a metallic foam core into a desired configuration; inserting a pre-machined component into an opening in the metallic foam core; applying an external metallic shell to an exterior surface of the metallic foam core after it has been formed into the desired configuration and after the pre-machined component has been inserted into the metallic foam core; introducing an acid into an internal cavity defined by the external metallic shell; dissolving the metallic foam core; and removing the dissolved metallic foam core from the internal cavity, wherein the component and the external metallic shell are resistant to the acid.

A deposition method is implemented in a focused ion beam system that supplies a compound gas to a specimen, and applies an ion beam to the specimen to deposit a deposition film, the deposition method including: a first deposition film-depositing step that deposits a first deposition film on the specimen using the ion beam that is defocused with respect to the specimen; and a second deposition film-depositing step that deposits a second deposition film on the first deposition film using the ion beam that is smaller in defocus amount than that used in the first deposition film-depositing step.

A metallized film capacitor includes: a metallized film columnar body including two metallized films that are laminated and wound, the two metalized films each including a vapor-deposited metal film with a plurality of vapor-deposition-free slits and fuse portions each interposed between the vapor-deposition-free slits, and a polyvinylidene fluoride dielectric film, the metallized film columnar body having two electrode extraction surfaces; metal-sprayed parts disposed respectively on the two electrode extraction surfaces: and outgoing terminals joined respectively to the metal-sprayed parts. Each of the two metallized films has a shape with successive sloped ridges and valleys in a cross-section orthogonal to a winding direction, and the two metallized films are laminated such that the ridges and valleys of one of the metallized films are aligned with the ridges and valleys of the other one of the metallized films.

In some examples, a method includes forming a photoresist layer on a surface of a metallic substrate and developing the photoresist layer to define a pattern exposing a portion of the surface of the metallic substrate. The method also may include forming an electrically conductive layer on a surface of the photoresist layer and the exposed portions of the surface of the metallic substrate. The electrically conductive layer contacts the exposed portions of the surface of the metallic substrate. The method may further include submerging the substrate, the photoresist layer, and the electrically conductive layer in an electrolyte solution; and applying a voltage to between a cathode and an anode submerged in the electrolyte solution to anisotropically etch the metallic substrate where the electrically conductive layer contacts the exposed portions of the surface of the metallic substrate to form at least one feature in the metallic substrate.

In some examples, a method includes forming a photoresist layer on a surface of a metallic substrate and developing the photoresist layer to define a pattern exposing a portion of the surface of the metallic substrate. The method also may include forming an electrically conductive layer on a surface of the photoresist layer and the exposed portions of the surface of the metallic substrate. The electrically conductive layer contacts the exposed portions of the surface of the metallic substrate. The method may further include submerging the substrate, the photoresist layer, and the electrically conductive layer in an electrolyte solution; and applying a voltage to between a cathode and an anode submerged in the electrolyte solution to anisotropically etch the metallic substrate where the electrically conductive layer contacts the exposed portions of the surface of the metallic substrate to form at least one feature in the metallic substrate.

An oxide superconducting wire, includes a laminate including a base material, an intermediate layer, and an oxide superconducting layer, the intermediate layer being laminated on a main surface of the base material, the intermediate layer being constituted of one or more layers having an orientation, the intermediate layer having one or more first non-orientation regions extending in a longitudinal direction of the base material, the oxide superconducting layer being laminated on the intermediate layer, the oxide superconducting layer having a crystal orientation controlled by the intermediate layer, the oxide superconducting layer having second non-orientation regions located on the first non-orientation regions, and a metal layer which covers at least a front surface and side surfaces of the oxide superconducting layer in the laminate.

A system for mapping a fracture comprising: a fracture located within a subterranean formation; a proppant pack located within the fracture, wherein at least a portion of the proppant are coated with a curable resin system comprising a curable resin and an electrically-conductive, nano-sized material, and wherein the coated proppant is electrically conductive; a transmitter that sends an electrical signal into the proppant pack; and a receiver that receives the electrical signal from the proppant pack. A method of mapping at least a portion of a fracture comprising: introducing proppant into the fracture; coating at least a portion of the proppant with a curable resin system, wherein the curable resin system comprises: a curable resin; and an electrically-conductive, nano-sized material, wherein at least the portion of the proppant becomes electrically-conductive after the step of coating; and using the electrically-conductive proppant to map at least the portion of the fracture.

A system for mapping a fracture comprising: a fracture located within a subterranean formation; a proppant pack located within the fracture, wherein at least a portion of the proppant are coated with a curable resin system comprising a curable resin and an electrically-conductive, nano-sized material, and wherein the coated proppant is electrically conductive; a transmitter that sends an electrical signal into the proppant pack; and a receiver that receives the electrical signal from the proppant pack. A method of mapping at least a portion of a fracture comprising: introducing proppant into the fracture; coating at least a portion of the proppant with a curable resin system, wherein the curable resin system comprises: a curable resin; and an electrically-conductive, nano-sized material, wherein at least the portion of the proppant becomes electrically-conductive after the step of coating; and using the electrically-conductive proppant to map at least the portion of the fracture.