Patent classifications
C23C16/02
COATED CUTTING TOOL
A coated cutting tool, comprising: a substrate; and a coating layer formed on a surface of the substrate, wherein the coating layer includes a lower layer and an upper layer in this order from the substrate side toward the surface side of the coating layer, and the upper layer is formed on a surface of the lower layer, the lower layer contains a compound having a composition represented by (Al.sub.xTi.sub.1-x)N, an average thickness of the lower layer is 1.0 μm or more and 15.0 μm or less, the upper layer contains an α-Al.sub.2O.sub.3 layer containing α-Al.sub.2O.sub.3, an average thickness of the upper layer is 0.5 μm or more and 15.0 μm or less, and in the α-Al.sub.2O.sub.3 layer, a texture coefficient TC (1, 1, 6) of a (1, 1, 6) plane is 2.0 or more and 6.0 or less.
Multi-layer protective coating
Methods and apparatus for preparing a protective coating are described. In one example aspect, an apparatus for preparing a protective coating includes a chamber, a substrate positioned within the chamber configured to hold at least a target object, an inlet pipe configured to direct a monomer vapor into the chamber, and one or more electrodes configured to perform a chemical vapor deposition process to produce a multi-layer coating. The chemical vapor deposition process comprises multiple cycles, each cycle comprising a pretreatment phase and a coating phase to produce a layer of the multi-layer coating.
Multi-layer protective coating
Methods and apparatus for preparing a protective coating are described. In one example aspect, an apparatus for preparing a protective coating includes a chamber, a substrate positioned within the chamber configured to hold at least a target object, an inlet pipe configured to direct a monomer vapor into the chamber, and one or more electrodes configured to perform a chemical vapor deposition process to produce a multi-layer coating. The chemical vapor deposition process comprises multiple cycles, each cycle comprising a pretreatment phase and a coating phase to produce a layer of the multi-layer coating.
Area selective CVD of metallic films using precursor gases and inhibitors
Provided herein are methods for forming a layer on a substrate wherein the layer is formed selectively on a first region of the substrate relative to a second region having a composition different than the first region. Methods of the invention include selectively forming a layer using an inhibitor agent capable of reducing the average acidity of a first region of the substrate having a composition characterized by a plurality of hydroxyl groups. Methods of the invention include selectively forming a layer by exposure of the substrate to: (i) an inhibitor agent comprising a substituted or an unsubstituted amine group, a substituted or an unsubstituted pyridyl group, a carbonyl group, or a combination of these, and (ii) a precursor gas comprising one or more ligands selected from the group consisting of a carbonyl group, an allyl group, combination thereof.
Broadband absorbers via nanostructures
The document discloses transferrable hyperbolic metamaterial particles (THMMP) that display broadband, selective, omnidirectional absorption and can be transferred to secondary substrates, allowing enhanced flexibility and selective transmission. A device having metamaterial nanostructures includes a substrate and metamaterial nanostructures engaged to the substrate to form an optical layer to interact with light incident to the optical layer to exhibit optical reflection or absorption or transmission that is substantially uniform over a spectral range of different optical wavelengths associated with materials and structural features of the metamaterial nanostructures, each metamaterial nanostructure including different material layers that are interleaved to form a multi-layer nanostructure.
Broadband absorbers via nanostructures
The document discloses transferrable hyperbolic metamaterial particles (THMMP) that display broadband, selective, omnidirectional absorption and can be transferred to secondary substrates, allowing enhanced flexibility and selective transmission. A device having metamaterial nanostructures includes a substrate and metamaterial nanostructures engaged to the substrate to form an optical layer to interact with light incident to the optical layer to exhibit optical reflection or absorption or transmission that is substantially uniform over a spectral range of different optical wavelengths associated with materials and structural features of the metamaterial nanostructures, each metamaterial nanostructure including different material layers that are interleaved to form a multi-layer nanostructure.
MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS
Molybdenum(0) and coordination complexes are described. Methods for depositing molybdenum-containing films on a substrate are described. The substrate is exposed to a molybdenum precursor and a reactant to form the molybdenum-containing film (e.g., elemental molybdenum, molybdenum oxide, molybdenum carbide, molybdenum silicide, molybdenum disulfide, molybdenum nitride). The exposures can be sequential or simultaneous.
ENHANCING GAPFILL PERFORMANCE OF DRAM WORD LINE
Methods of forming memory devices are described. A molybdenum silicide nucleation layer is formed, and the substrate is soaked in a titanium precursor prior to a bulk molybdenum gap fill process. In other embodiments, a molybdenum silicide film is formed in a first process cycle and a second process cycle is performed where the substrate is exposed to a titanium precursor. In further embodiments, a substrate having at least one feature thereon is exposed to a first titanium precursor and a nitrogen-containing reactant. The substrate is then soaked in a second titanium precursor, and then is exposed to a first molybdenum precursor followed by exposure to a silane to form a molybdenum silicide layer on a surface of the substrate.
SURFACE TREATMENT METHOD, REGION SELECTIVE FILM FORMATION METHOD FOR SUBSTRATE SURFACE, AND SURFACE TREATMENT AGENT
A surface treatment method for the substrate surface including two or more regions, the method including reacting a compound having the formula R.sup.1—P(═O)(OR.sup.2)(OR.sup.3), a basic nitrogen-containing compound, and the regions with each other such that a water contact angle on the metal region is greater by 10° or more with respect to a water contact angle on an insulator region close to the metal region. In compound (P-1), R.sup.1 is an alkyl group, an alkoxy group, a fluorinated alkyl group or an optionally substituted aromatic hydrocarbon group and R.sup.2 and R.sup.3 are each independently a hydrogen atom, an alkyl group, a fluorinated alkyl group or an optionally substituted aromatic hydrocarbon group.
Ozone for selective hydrophilic surface treatment
Processes for surface treatment of a workpiece are provided. In one example implementation, a method can include placing the workpiece on a workpiece support in a processing chamber. The method can include admitting a process gas into the processing chamber. The process gas can include an ozone gas. The method can include exposing the silicon nitride layer and the low-k dielectric layer to the process gas to modify a surface wetting angle of the silicon nitride layer.