A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.

A structure and a device may include an electromagnetic wave generator configured to generate electromagnetic waves; a shielding structure configured to surround at least a portion of the electromagnetic wave generator; and a metal layer provided on inner surfaces of upper and side portions of the shielding structure, wherein the metal layer having a predetermined surface roughness.

The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising ions of group IIIA metals and iodine containing, inorganic compounds in order to enhance bath stability.

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

The invention relates to a thermoplastic polymer composition comprising A. a polyamide B. a reinforcing agent, and C. an laser direct structuring (LDS) additive wherein the polyamide comprises a blend of —(A.1) a semi-crystalline semi-aromatic polyamide, and —(A.2) an amorphous semi-aromatic polyamide or an aliphatic polyamide, or a mixture thereof; or a blend of —(A.3) a semi-crystalline aliphatic polyamide, and —(A.4) an amorphous semi-aromatic polyamide; and D. a metal (di)phosphinate. The present invention further relates an article prepared form the thermoplastic polymer composition, and article made by a LDS process and a process for preparing the same.

Some devices and systems comprise one or more walls of a reaction chamber; an adjustable gap in the one or more walls, wherein the adjustable gap is formed between a first gap surface and a second gap surface facing the first gap surface, and wherein a distance between the first gap surface and the second gap surface is adjustable; a plurality of stops, wherein each stop of the plurality of stops is positioned on either the first gap surface or the second gap surface, wherein the plurality of stops ensure a minimum distance of the adjustable gap, wherein a total length of the plurality of stops is less than 1% of a length of the first gap surface; and one or more vacuum ports in the first gap surface or the second gap surface.

A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder are provided.

Provided are an electronic component manufacturing method by which even a platable layer made of a difficult-to-plate material can be easily plated with good adhesion without using a special chemical solution or a photolithography technique, and an electronic component which has a peel strength of 0.1 N/mm or greater as measured by a copper foil peel test. A picosecond laser beam having a pulse duration on the order of a picosecond or a femtosecond laser beam having a pulse duration on the order of a femtosecond is emitted at a surface of a platable layer (2) in order to roughen the surface, a wiring pattern is formed using a mask (13), and a plated part (12) is formed on the surface of the wiring pattern.

Provided is a method for manufacturing a semiconductor device that improves the reliability of the semiconductor device under thermal stress and the assembly performance of the semiconductor device in manufacturing steps. The method includes the following: forming a first electrode by depositing a first conductive film onto one main surface of a semiconductor substrate and patterning the first conductive film; forming a first metal film corresponding to a pattern of the first electrode onto the first electrode; forming a second electrode by depositing a second conductive film onto the other main surface of the semiconductor substrate; forming a second metal film thinner than the first metal film onto the second electrode; and collectively forming a third metal film onto each of the first metal film and the second metal film by electroless plating.

A method for fabricating a metallic wire mesh touch sensor with reduced visibility. A metallic wire mesh is formed on a transparent substrate such that the surface of the metallic wires is roughened or textured, so as to cause high scattering of incident light, thereby minimizing specularly reflected light towards the user. The metal lines are formed over patterned catalytic photoresist. The rough or textured surface of the metallic wires is achieved by roughening or texturing the catalytic photoresist, by selecting parameters of electronless plating of copper, or both. An RMS surface roughness of about 50 nm would scatter approximately 70% of incident cyan light incident at 30°.