Patent classifications
C23C18/54
METAL DISPLACEMENT SOLUTION, METHOD FOR SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY
The present invention aims to provide a metal displacement solution that can provide good adhesion to a plating film (metal film), and a method for surface treatment of aluminum or an aluminum alloy using the metal displacement solution. Included is a metal displacement solution which contains a zinc compound, a nickel compound, a germanium compound, and a fluorine compound.
Direct Printing of Catalyst Inks
Catalyst ink may be directly printed to a substrate using a stamp. Printed catalyst ink may converted to a pattern of one or more metal traces. Materials for a stamp and/or a substrate, and/or components of a catalyst ink, may be selected based on attraction of one or more of components of the catalyst ink to one or more print surfaces of the substrate and/or to one or more write surfaces of the stamp.
Direct Printing of Catalyst Inks
Catalyst ink may be directly printed to a substrate using a stamp. Printed catalyst ink may converted to a pattern of one or more metal traces. Materials for a stamp and/or a substrate, and/or components of a catalyst ink, may be selected based on attraction of one or more of components of the catalyst ink to one or more print surfaces of the substrate and/or to one or more write surfaces of the stamp.
METAL COMPOSITE STRUCTURE AND PROCESS FOR PRODUCING THE SAME
A magnesium alloy composite structure includes a magnesium alloy substrate, a zinc layer applied to the magnesium alloy substrate, a copper layer applied to the zinc layer, a nickel strike layer applied to the copper layer; an autocatalytic nickel layer applied to the nickel strike layer and a surface layer applied to the autocatalytic nickel layer. Various surface layers include Aluminum Titanium Nitride, Boron Nitride, Chromium Nitride, Titanium Nitride, Zirconium Nitride, Zirconium Oxide, Zirconium Oxycarbide, Titanium Carbide, Titanium Nitride and Diamond Like Carbon.
Metal plating apparatus for plating metal with zinc
A metal plating apparatus for plating metal with zinc is provided with a rotating device and a plurality of stirring devices. The rotating device has a driving assembly and a rotating assembly. The driving assembly has a driving gear. The rotating assembly is connected with and controlled by the driving assembly. The rotating assembly has a sustaining pillar. A rotating seat is mounted on the sustaining pillar and engaged with the driving gear. The stirring devices is mounted on the rotating seat radially and spaced from each other. The metal plating apparatus improves productivity through an automatic process which shifts locations of the stirring devices by the rotating device and plates metal with a cooperation of peripheral supporting apparatus, and improves working efficiency through decreasing occupied space and the number of operating personnel.
Metal plating apparatus for plating metal with zinc
A metal plating apparatus for plating metal with zinc is provided with a rotating device and a plurality of stirring devices. The rotating device has a driving assembly and a rotating assembly. The driving assembly has a driving gear. The rotating assembly is connected with and controlled by the driving assembly. The rotating assembly has a sustaining pillar. A rotating seat is mounted on the sustaining pillar and engaged with the driving gear. The stirring devices is mounted on the rotating seat radially and spaced from each other. The metal plating apparatus improves productivity through an automatic process which shifts locations of the stirring devices by the rotating device and plates metal with a cooperation of peripheral supporting apparatus, and improves working efficiency through decreasing occupied space and the number of operating personnel.
Apparatus for acoustic sensing
The invention provides an improved acoustic energy generating apparatus that includes an improved backing structure. The improved backing structure employs protrusions that are not located in a uniform pattern along a forward side surface of the backing structure, to realize improved re-direction of acoustic energy towards a forward direction relative to the acoustic energy generating apparatus.
Tufted Pile Fabric as Framework for Stretchable and Wearable Composite Electrodes
In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.
Tufted Pile Fabric as Framework for Stretchable and Wearable Composite Electrodes
In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.
WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER
The invention relates to a washing solution for a tin plating film after electroless tin plating and before water washing. The invention also relates to a method for forming a tin plating film, the method includes a step of washing step using the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution has a chloride ion concentration of 2 wt % or more, and a tin concentration of 0.5 wt % or less. The washing solution according to the present invention has good washing property for a tin plating film surface, and allows a tin plating film to easily maintain its properties. In addition the washing solution causes little influence on a tin plating film surface even when continuously used and is excellent in temporal stability.