An aluminum alloy sheet for a magnetic disk, a method for manufacturing same, and a magnetic disk using same. The aluminum alloy sheet is made of an aluminum alloy comprising 0.10 to 3.00 mass % of Fe, 0.003 to 1.000 mass % of Cu, and 0.005 to 1.000 mass % of Zn, with a balance of Al and unavoidable impurities, wherein a value obtained by dividing a difference in an area ratio (%) of second phase particles between a region (A) and a region (B) by an average value of area ratios (%) of second phase particles in the regions (A) and (B) is 0.05 or less, the region (A) being a region from a sheet thickness center plane to a front surface of the sheet, and the region (B) being a region from the sheet thickness center plane to a rear surface of the plate.

A color coating layer is formed on the surface of a stainless steel plate by a chemical coloring method or an electrolytic coloring method. Thereafter, a colored stainless steel plate having the color coating layer is cold-rolled, the thickness of the color coating layer is adjusted to between 0.05 μm and 1.0 μm, and an entire plate thickness is adjusted to 0.5 mm or less. By the cold rolling a Vickers hardness Hv is between 250 and 550 to form a deformed band. As surface roughness, an arithmetic average roughness Ra is adjusted to between 0.05 μm and 5.0 μm. In this manner, the strength and rigidity of a thin colored stainless steel plate can be secured, and a color stainless steel plate and a colored stainless steel coil which do not easily cause galling and are excellent in press moldability can be obtained.

A color coating layer is formed on the surface of a stainless steel plate by a chemical coloring method or an electrolytic coloring method. Thereafter, a colored stainless steel plate having the color coating layer is cold-rolled, the thickness of the color coating layer is adjusted to between 0.05 μm and 1.0 μm, and an entire plate thickness is adjusted to 0.5 mm or less. By the cold rolling a Vickers hardness Hv is between 250 and 550 to form a deformed band. As surface roughness, an arithmetic average roughness Ra is adjusted to between 0.05 μm and 5.0 μm. In this manner, the strength and rigidity of a thin colored stainless steel plate can be secured, and a color stainless steel plate and a colored stainless steel coil which do not easily cause galling and are excellent in press moldability can be obtained.

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.

Provided is a method for producing a composite alloy for use in an electrode for an alkaline storage battery, including a powder preparation step of preparing a hydrogen storage alloy powder containing Ti and Cr and having a BCC structure, an etching step of applying an acid to the hydrogen storage alloy powder prepared in the powder preparation step, a Pd film forming step of coating the surface of the hydrogen storage alloy powder subjected to the etching step with Pd using a substitution plating method, and a heat treatment step of heating the hydrogen storage alloy powder having a Pd film formed, at said heating being a temperature of 500° C. or less, wherein in the Pd coating forming step, the hydrogen storage alloy powder is coated with Pd under the condition that the Pd element weight ratio of the composite alloy to be produced is 0.47% or more.

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

Provided is a method for forming a metal film capable of forming a homogeneous metal film having a uniform film thickness by stably ensuring a fluid pressure of an electrolytic solution during film formation. The method places a substrate on a mount base. While sucking a gas between the substrate and a porous film through which the electrolytic solution can pass from a suction port of a suction passage formed on the mount base, the method brings the porous film into contact with the surface of the substrate. The method interrupts the suction passage while the porous film contacts the surface of the substrate. While interrupting the suction passage, the method allows the electrolytic solution to pass through the porous film while pressing the porous film against the surface of the substrate with a fluid pressure of the electrolytic solution and deposits metal from metal ions in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.