A rubber metal adhesive can be coated by screen printing, and can be effectively used for metal surface treatment at the time of forming a rubber-metal complex excellent in water resistance and heat resistance. The rubber metal adhesive comprises an organometallic compound, silica, magnesium silicate hydrate, and an organic solvent represented by the following general formula (I):

RO(CH2)2OHGeneral formula (I)

[wherein R represents an alkyl group having 3 or more carbon atoms or an aryl group.]

According to the present invention, there can be provided a resin composition comprising a phenylene ether resin and a petroleum resin, wherein the phenylene ether resin is represented by the following general formula (1):

##STR00001## wherein X represents a unit comprising an aromatic ring; Y.sub.1 and Y.sub.2, which may be the same or different, each represent a phenylene group; Z.sub.1 and Z.sub.2, which may be the same or different, each represent a hydrogen atom or a unit comprising a polymerizable double bonding group; and at least any one of m and n is not 0, and m and n represent an integer of 0 to 300, wherein in the general formula (1), with regard to the percentage (%) of the number of the polymerizable double bonding groups (A) [eq./g] and the number of hydroxyl groups (B) [eq./g], (A)/(B)=95.0 to 99.5/0.5 to 5.0.

According to the present invention, there can be provided a resin composition comprising a phenylene ether resin and a petroleum resin, wherein the phenylene ether resin is represented by the following general formula (1):

##STR00001## wherein X represents a unit comprising an aromatic ring; Y.sub.1 and Y.sub.2, which may be the same or different, each represent a phenylene group; Z.sub.1 and Z.sub.2, which may be the same or different, each represent a hydrogen atom or a unit comprising a polymerizable double bonding group; and at least any one of m and n is not 0, and m and n represent an integer of 0 to 300, wherein in the general formula (1), with regard to the percentage (%) of the number of the polymerizable double bonding groups (A) [eq./g] and the number of hydroxyl groups (B) [eq./g], (A)/(B)=95.0 to 99.5/0.5 to 5.0.

A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises forming a nanoscale roughened surface on the microscale roughened surface. The method further comprises the act of depositing discrete nanoparticles on the nanoscale roughened surface though a one-step process of exposing the roughened surface to a solution including the nanoparticles. The nanoparticles comprise a material having a property that promotes osseointegration.

A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises forming a nanoscale roughened surface on the microscale roughened surface. The method further comprises the act of depositing discrete nanoparticles on the nanoscale roughened surface though a one-step process of exposing the roughened surface to a solution including the nanoparticles. The nanoparticles comprise a material having a property that promotes osseointegration.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.

The present invention provides a contact member that strikes a balance between low electrical resistance and sliding durability under the condition of load as low as about 0.1 N. A contact member of the invention has a metal base and a coating disposed on at least part of the metal base. The coating contains fluorinated oil having a polar group, and metal particles surface-treated with a fluorine-based compound having a polar group.

The present invention provides a contact member that strikes a balance between low electrical resistance and sliding durability under the condition of load as low as about 0.1 N. A contact member of the invention has a metal base and a coating disposed on at least part of the metal base. The coating contains fluorinated oil having a polar group, and metal particles surface-treated with a fluorine-based compound having a polar group.

Described are metal bodies made of magnesium-containing metal and having a magnesium fluoride surface passivation region formed at a surface of the body, as well as methods of forming a magnesium fluoride surface passivation region at a surface of a metal body, and uses for the bodies.