In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

A welded steel part with a very high mechanical strength is provided. The welded steel part is obtained by heating followed by hot forming, then cooling of at least one welded blank obtained by butt welding of at least one first and one second sheet. The at least one first and second sheets including, at least in part, a steel substrate and a pre-coating which includes an intermetallic alloy layer in contact with the steel substrate, topped by a metal alloy layer of aluminum or aluminum-based alloy. A method for the fabrication of a welded steel part and the fabrication of structural or safety parts for automotive vehicles are also provided.

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.

This coated steel member includes: a steel sheet substrate having a predetermined chemical composition; and a coating formed on a surface of the steel sheet substrate and containing Al and Fe, in which the coating has a low Al content region having an Al content of 3 mass % or more and less than 30 mass % and a high Al content region formed on a side closer to a surface than the low Al content region and having an Al content of 30 mass % or more, a maximum C content of the high Al content region is 25% or less of a C content of the steel sheet substrate, a maximum C content of the low Al content region is 40% or less of the C content of the steel sheet substrate, and a maximum C content in a range from an interface between the steel sheet substrate and the coating to a depth of 10 μm on a side of the steel sheet substrate is 80% or less of the C content of the steel sheet substrate.

Disclosed are a hot-dip galvannealed steel sheet with ultra-high strength and high formability, and a manufacturing method therefor. In an exemplary embodiment, a hot-dip galvannealed steel sheet include: a base steel sheet; and a hot-dip galvannealed layer formed on the surface of the base steel sheet. The base steel sheet includes an amount of 0.05 to 0.15 wt % of carbon (C), an amount greater than 0 and less than or equal to 1.0 wt % of silicon (Si), an amount of 4.0 to 9.0 wt % of manganese (Mn), an amount greater than 0 and less than or equal to 0.6 wt % of aluminum (Al), an amount greater than 0 and less than or equal to 0.02 wt % of phosphorus (P) in, an amount greater than 0 and less than or equal to 0.005 wt % of sulfur (S), an amount greater than 0 and less than or equal to 0.006 wt % of nitrogen (N), and the balance of iron (Fe) and other inevitable impurities. The base steel sheet has a microstructure consisting of ferrite and retained austenite; the grain size of the microstructure is 3 μm or less; and the hot-dip galvannealed steel sheet has a yield strength (YS) of 800 MPa or greater, a tensile strength (TS) of 980 MPa or greater, an elongation (EL) of 25% or greater, and a hole expansion ratio (HER) of 20% or greater.

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.

The present invention pertains to a hot press forming member having excellent resistance to hydrogen embrittlement, and a method for manufacturing same. An aspect of the present invention provides a hot press forming member having excellent resistance to hydrogen embrittlement, the hot press forming member comprising a base steel plate and an alloy-plated layer formed on the surface of the base steel plate, wherein the alloy-plated layer contains pores such that pores having a size of 5 μm or less constitute 3-30% of the surface area of the alloy-plated layer as viewed in a cross-section taken in the thickness direction of the member.

A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 μm to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

The present application discloses a manufacturing method for a gate electrode and a thin film transistor, and a display panel, including: depositing an aluminum film on a substratum by physical vapor deposition; depositing a molybdenum film over the aluminum film by atomic layer deposition; and etching the aluminum film and the molybdenum film to form the gate electrode of a predetermined pattern.