A turbine part, such as a turbine blade or a distributor fin, for example, including a substrate made of superalloy based on monocrystalline nickel, including rhenium and/or ruthenium, and having a γ′-NisAI phase that is predominant by volume and a γ-Ni phase, the part also including a sublayer made of metal superalloy based on nickel covering the substrate, wherein the sublayer has a γ′-NisAI phase that is predominant by volume and wherein the sublayer has an average atomic fraction of aluminium of between 0.15 and 0.25, of chromium of between 0.03 and 0.08, of platinum of between 0.01 and 0.05, of hafnium of less than 0.01 and of silicon of less than 0.01. A process for manufacturing a turbine part including a step of vacuum deposition of a sublayer made of a superalloy based on nickel having predominantly by volume a γ′-NisAI phase, on a substrate made of superalloy based on nickel including rhenium and/or ruthenium.

The invention relates to a method for decorating a timepiece component comprising: a) a step of preparation of the timepiece component optionally comprising a first step of depositing a first material on the timepiece component to form a first sub-layer, b) a second step of depositing a second material on the timepiece component obtained in step a) to form a second sub-layer, c) a colouring step comprising the deposition of a third coloured material on the timepiece component obtained in step b) to form a coloured external decorative layer,

According to the invention, at least step b) and step c) are achieved by a physical vapour deposition method.

The invention relates to a method for producing an anti-corrosion coating for hardenable sheet steels, wherein at least two metal layers are deposited one after another onto the steel substrate; the one metal layer is a zinc layer or zinc-based layer and the other layer is a layer composed of a metal that forms baser intermetallic phases with Zn or Fe and has a higher oxidation potential than Zn, namely Ni, Cu, Co, Mn, or Mo, or a layer based on these metals; and an anti-corrosion coating for hardenable sheet steels.

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

The invention consists of a chromium electroplating solution comprising a chromium electroplating solution comprising: (1) a water soluble trivalent chromium salt; (2) at least one complexant for trivalent chromium ions; (3) a source of hydrogen ions sufficient to create a pH of from 2.8-4.2; (4) a pH buffering compound; and (5) a sulfur-containing organic compound. The chromium electroplating solution is usable in a method for producing an adherent metallic coating on a decorative article, such coating having enhanced resistance to corrosion in environments containing calcium chloride.

Method for producing metallic surface discharge electrodes on nonmetallic substrates comprising the following steps: a) producing a metallic seed layer on a substrate; b) electrically contacting the seed layer with a metal wire network and an electrolyte containing metal ions; c) electrodepositing a metal film from the electrolyte at least on the seed layer, with the metal wire network being embedded into the metal film, wherein d) metal wire filaments that are movable relative to one another are arranged to form an electrically percolating metal wire network, e) the arrangement of the metal wire filaments is cast into a gel and the gel is dried thereafter to the gel matrix, and f) the dried gel matrix with the metal wire network embedded therein is applied to the substrate and is wetted with a solvent of the gel matrix. Furthermore, the invention relates to a semifinished product for carrying out the method.

The present invention provides an iron-aluminum-based plated steel sheet, and a manufacturing method therefor, the iron-aluminum-based plated steel sheet comprising a base steel sheet and a plated layer formed on the surface of the base steel sheet, wherein the alloy plated layer comprises: a diffusion layer comprising an Fe—Al-based intermetallic compound having a cubic structure; and an alloyed layer formed on the diffusion layer and composed of an alloy phase differing from that of the cubic structure, the thickness of the diffusion layer is 3-20 μm, and the thickness of the diffusion layer is greater than 50% of the total thickness of the plated layer.

A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.

A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.