The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a light metal substrate including a first surface. A first micro-arc oxidation layer may be on the first surface of the light metal substrate, the first micro-arc oxidation layer can include a cationic dye bonded to the first surface via an anionic inorganic bridging compound.

A diffusion barrier coating on a nickel-based alloy substrate comprising the diffusion barrier being coupled to the substrate between the substrate and a abrasive composite material opposite the substrate, wherein the diffusion barrier comprises a nickel cobalt and chromium-aluminum-yttria powder material a high phosphorus nickel-P alloy.

A display device and a method of manufacturing the same are provided. The display device, comprises a first base substrate, a first barrier layer disposed on the first base substrate, a second base substrate disposed on the first barrier layer, at least one transistor disposed on the second base substrate, and an organic light emitting diode disposed on the at least one transistor, wherein the first barrier layer includes a silicon oxide, and has an adhesion force of 200 gf/inch or more to the second base substrate.

Embodiments of the present disclosure provides a housing assembly, a preparation method therefor and an electronic device. The housing assembly includes: a transparent substrate, including a decorative surface; wherein the decorative surface is arranged with a rough area; and a reflective layer, arranged on the decorative surface and at least partially covering the rough area.

An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.

The disclosure describes articles having coating systems configured to inhibit or prevent crystallization of TGO at the operating temperature of the article. An article includes a substrate defining a surface; a bond coat on the surface of the substrate; a coating layer that includes a boron dopant configured to inhibit crystallization of amorphous silicon dioxide thermally grown oxide on the bond coat at an operating temperature of the article. By inhibiting or preventing TGO crystallization, the described coating systems may increase a useable life of the component.

A photocatalytic assembly (100) includes a substrate (110) and a photocatalytic unit (120) laminated on the substrate (110). The photocatalytic unit (120) includes a laminated titanium dioxide layer (122) and a metal layer (124). The titanium dioxide layer (122) has a thickness of 10 nm to 100 nm. The metal layer (124) is formed by stacking metal nanoparticles. The metal nanoparticle is made of at least one selected from the group consisting of rhodium, palladium, platinum, gold, silver, and aluminum.

In a method for manufacturing an article, the article has a body having: a first face; and a first bevel surface extending from the first face. A plurality of first channels along the first bevel surface extending from the first face. A ceramic coating is along the inner diameter surface and the first bevel surface. Each of the first channels are machined in the body by plunging a rotating bit into the first surface and drawing the rotating bit down the bevel surface. The coating is thereafter applied.

Provided herein is a hydrogen permeation barrier coating, a coated substrate, and methods of coating a substrate.

A coated tool may include a base member and a coating layer located on the base member. The coating layer may include a plurality of AlTi layers including aluminum and titanium as a main component, and a plurality of AlCr layers including aluminum and chromium as a main component. The AlTi layers and the AlCr layers may be located alternately one upon another. The plurality of AlTi layers may include a first AlTi layer and a second AlTi layer located farther away from the base member than the first AlTi layer. Each of the plurality of AlTi layers may further include chromium, and a content ratio of chromium in the second AlTi layer may be higher than a content ratio of chromium in the first AlTi layer.