A coated cutting tool comprising a substrate containing a cubic boron nitride-containing sintered body, and a coating layer formed on the substrate, wherein the coating layer comprises a lowermost layer and an alternating laminate structure in this order, the lowermost layer comprises (Al.sub.1-xCr.sub.x)N, an average thickness of the lowermost layer is 0.01 μm or more and 0.2 μm or less, the alternating laminate structure includes mutually different two kinds of compound layers of a first compound layer containing (Al.sub.1-y1Cr.sub.y1)N and a second compound layer containing (Al.sub.1-y2Cr.sub.y2)N alternately laminated repeatedly twice or more, an average thickness of the entire alternating laminate structure is 0.1 μm or more and 1.2 μm or less, an average thickness of the entire coating layer is 0.2 μm or more and 1.3 μm or less, and a compressive residual stress at the cubic crystal (111) plane is 3.0 GPa or less.

A sliding member (10) including a coating film (1) composed of a hard carbon layer on a sliding surface (16) of a base material (11). The coating film has, when a cross section thereof is observed by a bright-field TEM image, a thickness within a range of 1 μm to 50 μm, and is configured by repeating units including black hard carbon layers (B), relatively shown in black, and white hard carbon layers (W), relatively shown in white, and laminated in a thickness direction, and comprise an inclined region, provided on a base material side, where thicknesses of white hard carbon layers (W) of the repeating units gradually increase in a thickness direction, and a homogeneous region\, provided on a surface side of the sliding member, where thicknesses of the white hard carbon layers (W) of the repeating units are the same or substantially the same in the thickness direction.

In one example, an article including a metallic substrate; and an abradable coating on the metallic substrate, the abradable coating including a plurality of abradable layers in an alternating arrangement with a plurality of CMAS resistant layers, wherein the plurality of CMAS resistant layers are configured to react with molten CMAS to form a stable phase.

A cutting tool comprises a substrate and an AlTiN layer, the AlTiN layer including a first major surface and a second major surface, the AlTiN layer including a first region having a distance of 0 nm or more and 30 nm or less from the first major surface and having a maximum oxygen content ratio of 30 atomic % or more, a second region having a distance of more than 30 nm and 100 nm or less from the first major surface and having a maximum oxygen content ratio of 5 atomic % or more and less than 30 atomic %, and a third region having a distance exceeding 100 nm from the first major surface and having a maximum oxygen content ratio of less than 5 atomic %.

The present invention relates to a coated cutting tool including a substrate and a coating. The coating has an inner α-Al.sub.2O.sub.3-multilayer and an outer α-Al.sub.2O.sub.3-single-layer. The thickness of the inner α-Al.sub.2O.sub.3-multilayer is 50% to 80% of the sum of the thickness of the inner α-Al.sub.2O.sub.3-multilayer and the thickness of the outer α-Al.sub.2O.sub.3-single-layer. The sum of the thickness of the inner α-Al.sub.2O.sub.3-multilayer and the outer α-Al.sub.2O.sub.3-single-layer is 2-15 μm. The α-Al.sub.2O.sub.3-multilayer has alternating sublayers of α-Al.sub.2O.sub.3 and sublayers of TiCO, TiCNO, AlTiCO or AlTiCNO, the α-Al.sub.2O.sub.3-multilayer having at least 8 sublayers of α-Al.sub.2O.sub.3.

A substrate with a multilayer reflection film for an EUV mask blank including a substrate, and a multilayer reflection film formed on the substrate is provided. The multilayer reflection film includes a Si/Mo laminated portion in which Si layers and Mo layers are alternately laminated, and a layer containing Si and N intervenes at one or more portions between the Si layer and the Mo layer of the Si/Mo laminated portion, and is contact with both of the Si layer and the Mo layer.

A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal structures, or different crystalline orientations, or different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Embodiments described and discussed herein provide methods for selectively depositing a metal oxides on a substrate. In one or more embodiments, methods for forming a metal oxide material includes positioning a substrate within a processing chamber, where the substrate has passivated and non-passivated surfaces, exposing the substrate to a first metal alkoxide precursor to selectively deposit a first metal oxide layer on or over the non-passivated surface, and exposing the substrate to a second metal alkoxide precursor to selectively deposit a second metal oxide layer on the first metal oxide layer. The method also includes sequentially repeating exposing the substrate to the first and second metal alkoxide precursors to produce a laminate film containing alternating layers of the first and second metal oxide layers. Each of the first and second metal alkoxide precursors contain different types of metals which are selected from titanium, zirconium, hafnium, aluminum, or lanthanum.

A hard coating includes a three kinds of layers that are alternately laminated. The three kinds of layers consist of a single composition layer and two kinds of nanolayer-alternated layers. The single composition layer is constituted by one of an A composition (nitride of AlCrSiα), a B composition (nitride of CrBSiβ) and a C composition (nitride of AlCr(SiC)γ). The two kinds of nanolayer-alternated layers include nanolayers which are alternately laminated and which are constituted by two of three combinations consisting of a combination of the A composition and B composition, a combination of the A composition and C composition and a combination of the B composition and C composition. The single composition layer has a thickness of 0.5-1000 nm. Each of the nanolayers constituting the two kinds of nanolayer-alternated layers has a thickness of 0.5-500 nm, and each of the two kinds of nanolayer-alternated layers has a thickness of 1-1000 nm.

Described herein is a transparent conductive film including (a) a first laminate including at least two layers containing TiO.sub.2, ZrO.sub.2 or HfO.sub.2, and a layer containing an organic compound in between the two layers containing TiO.sub.2, ZrO.sub.2 or HfO.sub.2, (b) a metal layer, and (c) a second laminate including at least two layers containing ZnO, a layer containing an organic compound between the two layers containing ZnO, and a metallic dopant other than zinc.