A chemical engraving machine to engrave a plate of stainless steel moved along an horizontal direction, said machine comprising a base, an acid liquid circuit adapted to chemically attack said plate of stainless steel at locations where it is not protected by a protection mask, a lower guiding device, an upper guiding device, the lower and upper guiding devices being configured to maintain said plate of stainless steel substantially vertically, and a nozzle support bearing a plurality of spraying nozzles projecting horizontally the acid liquid toward the plate of stainless steel. A method chemically engraves a plate of stainless steel in a vertical position.

The invention relates to a system for the local surface treatment of an aeronautical part (1) to be treated.

Said system is characterised in that it comprises a plurality of containers (18, 19, 20, 21) each comprising a treatment product (22, 23, 24, 25), at least one bath enclosure (102a, 102b) suitable for delimiting a fluid-tight space (26a, 26b) between this bath enclosure (102a, 102b) and a portion (101a, 101b) of the part to be treated, and a controlled circuit (10) for supplying said fluid-tight space (26a, 26b) with treatment product (22, 23, 24, 25) the containers (18, 19, 20, 21) connecting at least this container (18, 19, 20, 21) to said fluid-tight space (26a, 26b) and comprising valves for managing the supply to the fluid-tight space by one or more containers from the plurality of containers.

A build piece is made from a build plan by an additive metal deposition process, the build plan created from a three dimensional definition of a desired part, the build plan having a first set of dimensions corresponding to the desired part and includes a support structure. The build piece is to a chemical etchant such that the support structure is removed from the build piece and the dimensions of the build piece corresponding to the desired part are reduced to a second set of dimensions.

A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.

A method for leaching a PCD table for a cutter element includes (a) positioning a PCD table within a leaching chamber. The method also includes (b) submerging the PCD table in an acid within the leaching chamber. In addition, the method includes (c) sealing the leaching chamber. Further, the method includes (d) increasing the pressure within the leaching chamber to a pressure greater than or equal to 20,000 psi after (c).

A method for leaching a PCD table for a cutter element includes (a) positioning a PCD table within a leaching chamber. The method also includes (b) submerging the PCD table in an acid within the leaching chamber. In addition, the method includes (c) sealing the leaching chamber. Further, the method includes (d) increasing the pressure within the leaching chamber to a pressure greater than or equal to 20,000 psi after (c).

A copper process device with an explosion-proof function and a copper process explosion-proof method, the copper process device including a reaction chamber, a container provided below the reaction chamber for containing a solution for etching, a liquid inlet tube, a reflux tube, a temperature control unit, an automatic control unit and a pump on the liquid inlet tube. The reaction chamber is provided with a spray component for spraying the solution to a substrate therein, the liquid inlet tube is used for deliver the solution from the container to the spray component. The temperature control unit includes a temperature sensor for detecting a temperature of the solution within the container. The automatic control unit is electrically connected with the temperature control unit, and controls the pump to stop working when the temperature of the solution in the container is higher than a predetermined temperature range.

The present invention provides a wet etching device and an explosion prevention method thereof. The heater (22) is utilized to monitor the temperature in the liquid storage tank (2). When the temperature in the liquid storage tank (2) reaches the preset upper temperature limit, the control device (23) automatically deactivates the heater (22), and activates the chamber cleaning device (11) to spray the cleaning water. After washing the reaction chamber (1), the cleaning water flows back in the liquid storage tank (2) and neutralizes the etching solution in the liquid storage tank (2) to lower the temperature in the liquid storage tank (2). It can effectively monitor and reduce the temperature in the liquid storage tank (2) to prevent that the liquid storage tank (2) is overheated and explodes, to ensure the production safety and raise the production utilization rate.

An etching device includes a control unit, a transportation portion, a feeding portion, a conveyor belt, a plurality of cleaning bins spaced apart from each other, a first etching slot, a second etching slot, and a third etching slot. The transportation portion is arranged on one side of the cleaning bin facing away the first etching slot. The feeding portion is arranged at an outer side of a dry bin. The conveyor belt connects between the transportation portion and the feeding portion. The etching device further includes a fourth transportation bin, a first transportation bin, a second transportation bin, and a third transportation bin. The first transportation bin is arranged at one side of the first etching slot, and the first transportation bin connects with the first etching slot.

An etching device includes a control unit, a transportation portion, a feeding portion, a conveyor belt, a plurality of cleaning bins spaced apart from each other, a first etching slot, a second etching slot, and a third etching slot. The transportation portion is arranged on one side of the cleaning bin facing away the first etching slot. The feeding portion is arranged at an outer side of a dry bin. The conveyor belt connects between the transportation portion and the feeding portion. The etching device further includes a fourth transportation bin, a first transportation bin, a second transportation bin, and a third transportation bin. The first transportation bin is arranged at one side of the first etching slot, and the first transportation bin connects with the first etching slot.