Aspects of the disclosure include systems and methods for removing a sample from a carrier material and depositing the sample onto a substrate. The sample can be placed in an aperture of a substrate guide on a stage within a cavity. Etching fluid can be introduced into the cavity to etch the carrier material from the sample and then drained. A rinsing material can be introduced into the cavity to rinse the etching fluid and then drained. A sample deposition process can be performed wherein rinsing fluid is introduced into the cavity to raise the sample guide and sample above the level of a substrate on a substrate holder. The substrate holder can be positioned relative to the sample guide so that the sample within the aperture aligns with the substrate on the substrate holder. The rinsing fluid is drained so that the sample is lowered onto the substrate.

Aspects of the disclosure include systems and methods for removing a sample from a carrier material and depositing the sample onto a substrate. The sample can be placed in an aperture of a substrate guide on a stage within a cavity. Etching fluid can be introduced into the cavity to etch the carrier material from the sample and then drained. A rinsing material can be introduced into the cavity to rinse the etching fluid and then drained. A sample deposition process can be performed wherein rinsing fluid is introduced into the cavity to raise the sample guide and sample above the level of a substrate on a substrate holder. The substrate holder can be positioned relative to the sample guide so that the sample within the aperture aligns with the substrate on the substrate holder. The rinsing fluid is drained so that the sample is lowered onto the substrate.

A build piece is made from a build plan by an additive metal deposition process, the build plan created from a three dimensional definition of a desired part, the build plan having a first set of dimensions corresponding to the desired part and includes a support structure. The build piece is to a chemical etchant such that the support structure is removed from the build piece and the dimensions of the build piece corresponding to the desired part are reduced to a second set of dimensions.

A build piece is made from a build plan by an additive metal deposition process, the build plan created from a three dimensional definition of a desired part, the build plan having a first set of dimensions corresponding to the desired part and includes a support structure. The build piece is to a chemical etchant such that the support structure is removed from the build piece and the dimensions of the build piece corresponding to the desired part are reduced to a second set of dimensions.

A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.

A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.

A method of cleaning a substrate processing apparatus that etches a film including a metal includes (a) providing an inert gas, and removing a metal-containing deposition by plasma generated from the inert gas; and (b) after (a), providing a gas containing a fluorine-containing gas and an oxygen-containing gas, and removing a silicon-containing deposition by plasma generated from the gas containing the fluorine-containing gas and the oxygen-containing gas.

The present invention generally relates to a process for transferring a graphitic thin film and a kit for the same.

The present invention generally relates to a process for transferring a graphitic thin film and a kit for the same.

Aspects of the disclosure include systems and methods for removing a sample from a carrier material and depositing the sample onto a substrate. The sample can be placed in an aperture of a substrate guide on a stage within a cavity. Etching fluid can be introduced into the cavity to etch the carrier material from the sample and then drained. A rinsing material can be introduced into the cavity to rinse the etching fluid and then drained. A sample deposition process can be performed wherein rinsing fluid is introduced into the cavity to raise the sample guide and sample above the level of a substrate on a substrate holder. The substrate holder can be positioned relative to the sample guide so that the sample within the aperture aligns with the substrate on the substrate holder. The rinsing fluid is drained so that the sample is lowered onto the substrate.