Provided is an etchant composition for a multilayered metal film comprising both a layer comprising copper and a layer comprising molybdenum, the etchant composition: being capable of etching en bloc a multilayered metal film comprising a layer constituted of copper or an alloy including copper as the main component and a layer constituted of molybdenum or an alloy including molybdenum as the main component; being effective in preventing the molybdenum layer from being undercut; making it easy to regulate the component concentrations so as to accommodate the cross-sectional shape control and cross-section; and being stable. Also provided are a method of etching using the etchant composition and a method for prolonging the life of the etchant composition. The etchant composition according to the present invention is an etchant composition for use in etching en bloc a multilayered metal film comprising a layer constituted of copper or an alloy including copper as the main component and a layer constituted of molybdenum or an alloy including molybdenum as the main component, and comprises hydrogen peroxide, an organic acid, an amine compound, an azole, and a hydrogen peroxide stabilizer (no inorganic acid is contained therein).

The present disclosure relates to the fields of chemical engineering and environmental protection, and in particular to a method of preparing high purity copper sulfate by using an acidic copper chloride etching waste liquid, which includes: introducing liquid ammonia into a first acidic copper chloride etching solution and a second acidic copper chloride etching solution, mixing the obtained solutions and allowing the mixture to be subjected to crystallization and filtration to produce an intermediate copper oxychloride; washing and separating copper oxychloride and adding it into a sulfuric acid solution to obtain a copper sulfate slurry, and then adding water to the copper sulfate slurry and performing cooling, crystallization and separation to obtain Semi-finished copper sulfate; adding a first solution to Semi-finished copper sulfate and then performing heating, and temperature-controlled filtration, and performing cooling, crystallization and centrifugation on an obtained first filtrate so as to obtain a high purity copper sulfate.

In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): ##STR00001##
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

The present invention relates to a process of oxidizing copper in a copper etching solution by using oxygen gas and/or air as an oxidizing agent, the process comprising the steps of: a) introducing the oxidizing agent into an acidic reduced copper etching solution comprising Cl.sup. and Cu.sup.+, b) stirring the solution obtained in step a), and thereby allowing the reaction 2Cu.sup.++O.sub.2 (aq)+2H.sup.+.fwdarw.2Cu.sup.2++H.sub.2O to occur, thereby producing an oxidized copper etching solution comprising less Cu.sup.+ than the reduced copper etching solution. An advantage of the present invention is that it provides an improved process at least in terms of the speed of the oxidation and the quality of the etching.

The present invention relates to a process of oxidizing copper in a copper etching solution by using oxygen gas and/or air as an oxidizing agent, the process comprising the steps of: a) introducing the oxidizing agent into an acidic reduced copper etching solution comprising Cl.sup. and Cu.sup.+, b) stirring the solution obtained in step a), and thereby allowing the reaction 2Cu.sup.++O.sub.2 (aq)+2H.sup.+.fwdarw.2Cu.sup.2++H.sub.2O to occur, thereby producing an oxidized copper etching solution comprising less Cu.sup.+ than the reduced copper etching solution. An advantage of the present invention is that it provides an improved process at least in terms of the speed of the oxidation and the quality of the etching.

Embodiments of the present disclosure disclose a wet etching equipment and a wet etching method. The wet etching equipment includes a metal ion concentration adjusting device configured to adjust the concentration of metal ions in an etching solution, a sprinkler which is connected to the metal ion concentration adjusting device and configured to spray the etching solution. Embodiments of the present disclosure also disclose a wet etching method, comprising steps as follows: adjusting a concentration of metal ions in an etching solution so that an etching rate of a metal to be etched is kept stable; spraying the adjusted etching solution onto the metal to be etched.

Embodiments of the present disclosure disclose a wet etching equipment and a wet etching method. The wet etching equipment includes a metal ion concentration adjusting device configured to adjust the concentration of metal ions in an etching solution, a sprinkler which is connected to the metal ion concentration adjusting device and configured to spray the etching solution. Embodiments of the present disclosure also disclose a wet etching method, comprising steps as follows: adjusting a concentration of metal ions in an etching solution so that an etching rate of a metal to be etched is kept stable; spraying the adjusted etching solution onto the metal to be etched.

Provided is a copper etchant composition including: a first organic acid containing one or more amine groups, and one or more carboxylic acid groups; a second organic acid; an amine compound; hydrogen peroxide; and a phosphate compound, which has the increased number of processing sheets and etching uniformity, when etching copper.

Disclosed is a method and device for recycling an acidic etching waste solution through progressive electrolysis. The method includes: introducing at least one electrolytic cell A, where the electrolytic cell A is divided into an anode chamber and a cathode chamber; during an electrolysis operation, a cathode electrolyte of the electrolytic cell A includes the acidic etching waste solution; and introducing at least one electrolytic cell B, where the electrolytic cell B is divided into an anode chamber and a cathode chamber; the cathode electrolyte of the electrolytic cell B includes a cathode electrolyte undergoing an electrolytic treatment from the electrolytic cell A or a mixed solution of the cathode electrolyte undergoing the electrolytic treatment with the acidic etching waste solution. With the present disclosure, PCB manufacturers can avoid the introduction of new impurities and reduce the electrolysis energy consumption during an electrolytic copper recovery process.

The present disclosure discloses a method for recycling of PCB copper chloride etching waste solution through precipitation treatment and an apparatus applicable thereto, including mixing a PCB copper chloride etching waste solution with a pH value adjusting agent for reaction, so that copper salt precipitates in the solution, and at least one of the PCB copper chloride etching waste solution and the pH value adjusting agent contains a PCB copper chloride etching waste solution containing ammonium and/or ammonia; and, subjecting a solid-liquid mixture obtained in step (1) to SLS to obtain filtrate A and filter residue C; and carrying out ammonia nitrogen removal treatment on the filter residue C to generate recovered copper products; and finally, reusing all or part of the filtrate A directly or after composition adjustment to the PCB copper chloride etching system as a regenerated etching replenishment solution and/or an etching oxidant solution.