The present disclosure discloses a method for recycling of PCB copper chloride etching waste solution through precipitation treatment and an apparatus applicable thereto, including mixing a PCB copper chloride etching waste solution with a pH value adjusting agent for reaction, so that copper salt precipitates in the solution, and at least one of the PCB copper chloride etching waste solution and the pH value adjusting agent contains a PCB copper chloride etching waste solution containing ammonium and/or ammonia; and, subjecting a solid-liquid mixture obtained in step (1) to SLS to obtain filtrate A and filter residue C; and carrying out ammonia nitrogen removal treatment on the filter residue C to generate recovered copper products; and finally, reusing all or part of the filtrate A directly or after composition adjustment to the PCB copper chloride etching system as a regenerated etching replenishment solution and/or an etching oxidant solution.

A method for electrolytic recycling and regenerating acidic cupric chloride etchants, comprising: (1) employing an acidic cupric chloride etchant that contains iron ions in PCB etching, controlling the oxidation-reduction potential (ORP) of said acidic cupric chloride etchant within the range of 360-700 mV; (2) transferring an etchant waste of step (1) to an electrolysis tank and electrolysing said etchant waste; (3) the chlorine gas generated by electrolysis oxidizes the electrolyte in the electrolysis tank and thereby dissolved into the electrolyte, in the effect of the ORP of the electrolyte; (4) regenerating an etchant by oxidizing Fe(II) ions and Cu(I) ions in the electrolyte to Fe(III) ions and Cu(II) ions using the chlorine gas of step (3) that is dissolved into the electrolyte, and when the chlorine gas is fully dissolved into the electrolyte, the oxidizing step of the electrolyte is finished and an etchant is regenerated; (5) transferring the etchant regenerated in step (4) to an etching production line.

The present invention relates to a process of oxidizing copper in a copper etching solution by using oxygen gas and/or air as an oxidizing agent, the process comprising the steps of: a) introducing the oxidizing agent into an acidic reduced copper etching solution comprising Cl.sup. and Cu.sup.+, b) stirring the solution obtained in step a), and thereby allowing the reaction 2Cu.sup.++O.sub.2 (aq)+2H.sup.+.fwdarw.2Cu.sup.2++H.sub.2O to occur, thereby producing an oxidized copper etching solution comprising less Cu.sup.+ than the reduced copper etching solution. An advantage of the present invention is that it provides an improved process at least in terms of the speed of the oxidation and the quality of the etching.

The present invention relates to a process of oxidizing copper in a copper etching solution by using oxygen gas and/or air as an oxidizing agent, the process comprising the steps of: a) introducing the oxidizing agent into an acidic reduced copper etching solution comprising Cl.sup. and Cu.sup.+, b) stirring the solution obtained in step a), and thereby allowing the reaction 2Cu.sup.++O.sub.2 (aq)+2H.sup.+.fwdarw.2Cu.sup.2++H.sub.2O to occur, thereby producing an oxidized copper etching solution comprising less Cu.sup.+ than the reduced copper etching solution. An advantage of the present invention is that it provides an improved process at least in terms of the speed of the oxidation and the quality of the etching.

Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

Provided is, for example, a lubricant for filtration which has a surface tension of 60-75 mN/m and which contains onium ions. Also provided are a composition for polishing which contains onium ions and hypohalous acid ions, a metal recovery agent which contains onium ions coordinated to metal oxide ions or metal hydroxide ions, and the like.

A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): ##STR00001##
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): ##STR00001##
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

Provided are a method for electrolysis-assisted oxidative regeneration of an alkaline copper-ammonia chloride etching working solution, and an apparatus using the same. The method includes the following steps: (1) selecting an electrolytic cell provided with an electrolytic cell separator; (2) with the alkaline copper-ammonia chloride etching working solution as an anode electrolyte, conducting electrolysis in the electrolytic cell, where a reaction of oxidatively regenerating a copper-etching agent occurs in the anode cell zone; and during the electrolysis, an etching working solution circularly flows between the etching machine and the anode cell zone of the electrolytic cell; and (3) during the electrolysis, controlling an oxidation-reduction potential (ORP) potential value of the anode electrolyte at 300 mV or less, and feeding an etching replenisher into the alkaline copper-ammonia chloride etching working solution to participate in the reaction of oxidatively regenerating the copper-etching agent.