Provided are a method for electrolysis-assisted oxidative regeneration of an alkaline copper-ammonia chloride etching working solution, and an apparatus using the same. The method includes the following steps: (1) selecting an electrolytic cell provided with an electrolytic cell separator; (2) with the alkaline copper-ammonia chloride etching working solution as an anode electrolyte, conducting electrolysis in the electrolytic cell, where a reaction of oxidatively regenerating a copper-etching agent occurs in the anode cell zone; and during the electrolysis, an etching working solution circularly flows between the etching machine and the anode cell zone of the electrolytic cell; and (3) during the electrolysis, controlling an oxidation-reduction potential (ORP) potential value of the anode electrolyte at 300 mV or less, and feeding an etching replenisher into the alkaline copper-ammonia chloride etching working solution to participate in the reaction of oxidatively regenerating the copper-etching agent.

A process for regenerating chemical milling solutions involves introducing a silicon-containing reagent into a solution to establish a molar ratio of Si/Al equal to 1 in the solution. The process further involves letting the silicon and aluminum in the solution react up at least to formation of a phase containing aluminosilicates.

A process for regenerating chemical milling solutions involves introducing a silicon-containing reagent into a solution to establish a molar ratio of Si/Al equal to 1 in the solution. The process further involves letting the silicon and aluminum in the solution react up at least to formation of a phase containing aluminosilicates.

A bowl includes a body portion having a recovery hole to which a recovery line is connected, a guide portion extending upwardly from an upper portion of the body portion and then extending in a lateral direction, and a connection frame installed across the inside of the body portion and the inside of the guide portion.

A bowl includes a body portion having a recovery hole to which a recovery line is connected, a guide portion extending upwardly from an upper portion of the body portion and then extending in a lateral direction, and a connection frame installed across the inside of the body portion and the inside of the guide portion.

A substrate processing apparatus includes a substrate processing unit for processing a substrate by discharging a chemical liquid to the substrate; a chemical storage unit connected to the substrate processing unit by a chemical liquid supply line and a chemical liquid recovery line; and a liquid replenishment unit including an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid, and a water supply member for supplying water to the chemical liquid.

A substrate processing apparatus includes a substrate processing unit for processing a substrate by discharging a chemical liquid to the substrate; a chemical storage unit connected to the substrate processing unit by a chemical liquid supply line and a chemical liquid recovery line; and a liquid replenishment unit including an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid, and a water supply member for supplying water to the chemical liquid.

Method for recovering Cr from a pickling bath of an aqueous solution containing sulphate and Cr from a pickled metal, the method including: forming an aqueous two-phase system from a portion of the pickling bath and a polymer including an unhindered ether function, the proportion of polymer in the ternary mixture including the pickling bath, considered to be a unique chemical component, water and polymer, ranging between the line of the equation weight % of polymer=100%weight % of pickling bath and the binodal curve of the pickling bath/polymer mixture, the two-phase aqueous system including polymer and non-polymer phases; separating the respective phases; allowing precipitates containing Cr to form in the polymer phase; carrying out solid/liquid separation of the polymer phase to separate the polymer and the precipitates containing Cr; and processing the precipitates to recover the Cr. A facility is also disclosed.

Disclosed are wastewater treatment systems and methods for semiconductor fabrication process. The method comprises performing first concentration on wastewater discharged from a semiconductor process chamber, and performing second concentration on concentrated wastewater or at least a portion of the wastewater concentrated by the first concentration. The step of performing the first concentration includes performing in a first electrodialysis apparatus an ion exchange between the wastewater and first treatment water. The step of performing the second concentration includes allowing the concentrated wastewater to circulate in a second electrodialysis apparatus, allowing second treatment water to circulate in the second electrodialysis apparatus, providing a power to an anode and a cathode of the second electrodialysis apparatus to perform an ion exchange between the second treatment water and the concentrated wastewater, and joining a portion of the concentrated wastewater to the second treatment water.