A composition for pickling a welded portion and a rust-generated portion according to installation of pipes, structures, plants, and so on formed of stainless steel, and for forming a passive state film thereon is provided. More particularly, the present disclosure relates to a neutral agent for passivating a surface of stainless steel metal in which a neutral agent is obtained by neutralizing a basic aqueous solution to 6.9 pH to 7.1 pH and aerated with carbon dioxide-free air to increase the amount of dissolved oxygen, so that an oxidation reduction potential in a range of 170 mV to 310 mV is obtained.

A composition for pickling a welded portion and a rust-generated portion according to installation of pipes, structures, plants, and so on formed of stainless steel, and for forming a passive state film thereon is provided. More particularly, the present disclosure relates to a neutral agent for passivating a surface of stainless steel metal in which a neutral agent is obtained by neutralizing a basic aqueous solution to 6.9 pH to 7.1 pH and aerated with carbon dioxide-free air to increase the amount of dissolved oxygen, so that an oxidation reduction potential in a range of 170 mV to 310 mV is obtained.

The present disclosure relates to compositions, systems and methods for removing iron sulfide scale from a solid object, such as an oilfield component. The compositions include a carbon-carbon (CC) double bond with an electron withdrawing group bonded to at least one of the double-bonded carbons.

The present disclosure relates to compositions, systems and methods for removing iron sulfide scale from a solid object, such as an oilfield component. The compositions include a carbon-carbon (CC) double bond with an electron withdrawing group bonded to at least one of the double-bonded carbons.

Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.

Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.

A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.

A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.

A removal method applied to an aluminum electrode sheet with an oxide layer, including a soaking step. The soaking step includes soaking the aluminum electrode sheet in an ionic liquid to remove the oxide layer, such that the aluminum electrode sheet has an exposed part of aluminum metal, and the soaking step is performed in a nitrogen atmosphere.

A removal method applied to an aluminum electrode sheet with an oxide layer, including a soaking step. The soaking step includes soaking the aluminum electrode sheet in an ionic liquid to remove the oxide layer, such that the aluminum electrode sheet has an exposed part of aluminum metal, and the soaking step is performed in a nitrogen atmosphere.