C25C1/20

DENDRITIC SILVER POWDER
20180326478 · 2018-11-15 ·

Disclosed is a new dendritic silver powder which, when mixed with a synthetic resin, gives electroconductive films having sufficient electroconductivity. Even when the films produced from a mixture of the dendritic silver powder and a synthetic resin vary in thickness, the electroconductivity of the films can be maintained. The volume-cumulative particle diameter D50 (referred to as D50D) determined by adding the silver powder to water containing a dispersant, applying 300-watt ultrasonic waves to the resultant mixture for 3 minutes, and examining the dispersion with a laser diffraction/scattering type particle size analyzer is 1.0-15.0 m and that the ratio of the volume-cumulative particle diameter D50 (referred to as D50) determined by adding the silver powder to the water containing a dispersant and examining the mixture under the same conditions as for the D50D except that no ultrasonic waves are applied, to the D50D, D50N/D50D, is 1.0-10.0.

DENDRITIC SILVER POWDER
20180326478 · 2018-11-15 ·

Disclosed is a new dendritic silver powder which, when mixed with a synthetic resin, gives electroconductive films having sufficient electroconductivity. Even when the films produced from a mixture of the dendritic silver powder and a synthetic resin vary in thickness, the electroconductivity of the films can be maintained. The volume-cumulative particle diameter D50 (referred to as D50D) determined by adding the silver powder to water containing a dispersant, applying 300-watt ultrasonic waves to the resultant mixture for 3 minutes, and examining the dispersion with a laser diffraction/scattering type particle size analyzer is 1.0-15.0 m and that the ratio of the volume-cumulative particle diameter D50 (referred to as D50) determined by adding the silver powder to the water containing a dispersant and examining the mixture under the same conditions as for the D50D except that no ultrasonic waves are applied, to the D50D, D50N/D50D, is 1.0-10.0.

SELECTIVE REMOVAL OF NOBLE METALS USING ACIDIC FLUIDS, INCLUDING FLUIDS CONTAINING NITRATE IONS

The recovery of noble metal(s) from noble-metal-containing material is generally described. The noble metal(s) can be recovered selectively, in some cases, such that noble metal(s) is at least partially separated from non-noble-metal material within the material. Noble metal(s) may be recovered from noble-metal-containing material using mixtures of acids, in some instances. In some cases, the mixture can comprise nitric acid and/or another source of nitrate ions and at least one supplemental acid, such as sulfuric acid, phosphoric acid, and/or a sulfonic acid. The amount of nitrate ions within the mixture can be, in some instances, relatively small compared to the amount of supplemental acid within the mixture. In some cases, the recovery of noble metal(s) using the acid mixtures described herein can be enhanced by transporting an electric current between an electrode and the noble metal(s) of the noble-metal-containing material. In some cases, acid mixtures can be used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and/or scrap material comprising silver metal and tungsten metal.

SELECTIVE REMOVAL OF NOBLE METALS USING ACIDIC FLUIDS, INCLUDING FLUIDS CONTAINING NITRATE IONS

The recovery of noble metal(s) from noble-metal-containing material is generally described. The noble metal(s) can be recovered selectively, in some cases, such that noble metal(s) is at least partially separated from non-noble-metal material within the material. Noble metal(s) may be recovered from noble-metal-containing material using mixtures of acids, in some instances. In some cases, the mixture can comprise nitric acid and/or another source of nitrate ions and at least one supplemental acid, such as sulfuric acid, phosphoric acid, and/or a sulfonic acid. The amount of nitrate ions within the mixture can be, in some instances, relatively small compared to the amount of supplemental acid within the mixture. In some cases, the recovery of noble metal(s) using the acid mixtures described herein can be enhanced by transporting an electric current between an electrode and the noble metal(s) of the noble-metal-containing material. In some cases, acid mixtures can be used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and/or scrap material comprising silver metal and tungsten metal.

Systems and methods for producing metal clusters; functionalized surfaces; and droplets including solvated metal ions

The invention generally relates to systems and methods for producing metal clusters; functionalized surfaces; and droplets including solvated metal ions. In certain aspects, the invention provides methods that involve providing a metal and a solvent. The methods additionally involve applying voltage to the solvated metal to thereby produce solvent droplets including ions of the metal containing compound, and directing the solvent droplets including the metal ions to a target. In certain embodiments, once at the target, the metal ions can react directly or catalyze reactions.

Systems and methods for producing metal clusters; functionalized surfaces; and droplets including solvated metal ions

The invention generally relates to systems and methods for producing metal clusters; functionalized surfaces; and droplets including solvated metal ions. In certain aspects, the invention provides methods that involve providing a metal and a solvent. The methods additionally involve applying voltage to the solvated metal to thereby produce solvent droplets including ions of the metal containing compound, and directing the solvent droplets including the metal ions to a target. In certain embodiments, once at the target, the metal ions can react directly or catalyze reactions.

SHORT PROCESS METHOD FOR EXTRACTING PRECIOUS METALS BY INTEGRATING THIOSULFATE ELECTROCHEMICAL LEACHING AND RECOVERY
20250230520 · 2025-07-17 ·

The invention discloses a short process method for extracting precious metals by integrating thiosulfate electrochemical leaching and recovery, which includes: dissolving thiosulfate and an electrolyte, adding an alkaline solution, stirring evenly to obtain an electrolytic solution; adjusting the pH of the electrolytic solution to 7-13, then placing the electrolytic solution and materials containing precious metals in the electrolytic cell, and using an electrode system set in an electrolytic cell for electrolysis reaction, so that precious metals are leached at the anode and deposited at the cathode; collecting precious metals deposited on the cathode. This invention can simultaneously achieve the integrated extraction of anode precious metal leaching and cathode precious metal ion electrolytic deposition, as well as precious metal leaching and recovery in one reaction device; It has the advantages of high extraction efficiency, short process flow, low reagent consumption, low energy consumption, and no pollution.

SHORT PROCESS METHOD FOR EXTRACTING PRECIOUS METALS BY INTEGRATING THIOSULFATE ELECTROCHEMICAL LEACHING AND RECOVERY
20250230520 · 2025-07-17 ·

The invention discloses a short process method for extracting precious metals by integrating thiosulfate electrochemical leaching and recovery, which includes: dissolving thiosulfate and an electrolyte, adding an alkaline solution, stirring evenly to obtain an electrolytic solution; adjusting the pH of the electrolytic solution to 7-13, then placing the electrolytic solution and materials containing precious metals in the electrolytic cell, and using an electrode system set in an electrolytic cell for electrolysis reaction, so that precious metals are leached at the anode and deposited at the cathode; collecting precious metals deposited on the cathode. This invention can simultaneously achieve the integrated extraction of anode precious metal leaching and cathode precious metal ion electrolytic deposition, as well as precious metal leaching and recovery in one reaction device; It has the advantages of high extraction efficiency, short process flow, low reagent consumption, low energy consumption, and no pollution.

ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING
20180237933 · 2018-08-23 ·

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of SnAg alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING
20180237933 · 2018-08-23 ·

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of SnAg alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.