Patent classifications
C25C1/20
VALUABLE METAL SELECTIVELY ADSORBING ELECTRODE AND METHOD FOR SELECTIVELY RECOVERING VALUABLE METALS
The present disclosure provides a valuable metal selectively adsorbing electrode, including: an electrode formed by a carbon-containing material; and a protein of a bacterium of genus Tepidimonas immobilized on the electrode formed by a carbon-containing material to form the valuable metal selectively adsorbing electrode, wherein the valuable metal includes gold, palladium, silver or indium.
VALUABLE METAL SELECTIVELY ADSORBING ELECTRODE AND METHOD FOR SELECTIVELY RECOVERING VALUABLE METALS
The present disclosure provides a valuable metal selectively adsorbing electrode, including: an electrode formed by a carbon-containing material; and a protein of a bacterium of genus Tepidimonas immobilized on the electrode formed by a carbon-containing material to form the valuable metal selectively adsorbing electrode, wherein the valuable metal includes gold, palladium, silver or indium.
Electroplating apparatus and process for wafer level packaging
An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of SnAg alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
Electroplating apparatus and process for wafer level packaging
An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of SnAg alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
Treatment process for extraction of precious, base and rare elements
This invention describes a hydrometallurgical process for the recovery and separation of valuable elements, in particular gold and silver, from a feed material comprising a refractory, intractable or otherwise poorly responding to conventional treatment routes ores, concentrates and other materials. In particular, the process is a process integrated into one or more existing value element extraction processes.
Treatment process for extraction of precious, base and rare elements
This invention describes a hydrometallurgical process for the recovery and separation of valuable elements, in particular gold and silver, from a feed material comprising a refractory, intractable or otherwise poorly responding to conventional treatment routes ores, concentrates and other materials. In particular, the process is a process integrated into one or more existing value element extraction processes.
METHODS FOR SIMULTANEOUS LEACHING AND EXTRACTION OF PRECIOUS METALS
The present applications relates to methods for the simultaneous leaching and extraction of precious metals. For example, the present application relates to methods of leaching and extracting gold and/or palladium from a substance comprising gold and/or palladium such as a gold- and/or palladium-containing ore in one step using a compound of Formula I:(I).
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METHODS FOR SIMULTANEOUS LEACHING AND EXTRACTION OF PRECIOUS METALS
The present applications relates to methods for the simultaneous leaching and extraction of precious metals. For example, the present application relates to methods of leaching and extracting gold and/or palladium from a substance comprising gold and/or palladium such as a gold- and/or palladium-containing ore in one step using a compound of Formula I:(I).
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METHODS FOR SELECTIVE LEACHING AND EXTRACTION OF PRECIOUS METALS IN ORGANIC SOLVENTS
The present application relates to methods for leaching and extraction of precious metals. For example, the present application relates to methods of leaching gold, palladium and/or platinum from a substance comprising gold, palladium and/or platinum (such as a gold-containing ore or a platinum group metal (PGM) concentrate) using an organic solvent that is water-miscible or partially water-miscible.
SUPRAMOLECULAR GOLD STRIPPING FROM ACTIVATED CARBON USING ALPHA-CYCLODEXTRIN
Disclosed herein are compositions, methods, and systems for supramolecular gold stripping where the composition comprises a surface-bound, linear gold anion and a solution comprising a molecular receptor that facilitates the transfer of the linear gold anion from the surface to the solution.