C25C5/02

APPARATUS, SYSTEMS AND METHODS FOR HIGH EFFICIENCY METAL PARTICLE REGENERATION

A method for generating a metallic particle slurry in a regenerator, the method comprising the steps of: (a) generating metallic particles on a surface of a cathode by applying a forward current for a forward current period; (b) displacing the metallic particles from the surface of the cathode by applying a displacement force for a displacement period; (c) dissolving residual metallic particles by applying a reverse current for a reverse current period; (d) providing a plurality of regenerator cells; and (e) establishing an airlock by isolating aqueous electrolyte between cavities of regenerator cells.

Method for smelterless recycling of lead acid batteries

Lead from lead acid battery scrap is recovered in two separate production streams as clean grid lead and as high-purity lead without smelting. In preferred aspects, lead recovery is performed in a continuous process that uses an aqueous electroprocessing solvent and electro-refining and spent electroprocessing solvent can be recycled to the recovery process.

Zinc electrodes for batteries

A method of: providing an emulsion having a zinc powder and a liquid phase; drying the emulsion to form a sponge; sintering the sponge in an inert atmosphere to form a sintered sponge; heating the sintered sponge in an oxidizing atmosphere to form an oxidized sponge having zinc oxide on the surface of the oxidized sponge; and heating the oxidized sponge in an inert atmosphere at above the melting point of the zinc. A method of: providing an emulsion comprising a zinc powder and a liquid phase; placing the emulsion into a mold, wherein the emulsion is in contact with a metal substrate; and drying the emulsion to form a sponge.

Zinc electrodes for batteries

A method of: providing an emulsion having a zinc powder and a liquid phase; drying the emulsion to form a sponge; sintering the sponge in an inert atmosphere to form a sintered sponge; heating the sintered sponge in an oxidizing atmosphere to form an oxidized sponge having zinc oxide on the surface of the oxidized sponge; and heating the oxidized sponge in an inert atmosphere at above the melting point of the zinc. A method of: providing an emulsion comprising a zinc powder and a liquid phase; placing the emulsion into a mold, wherein the emulsion is in contact with a metal substrate; and drying the emulsion to form a sponge.

METHOD FOR MODIFYING AN ELECTRICALLY CONDUCTIVE OXIDE SURFACE, USE FOR ELECTRODEPOSITION OF COPPER ON SAID SURFACE

The present invention relates to a method for modifying the surface of a substrate made of electrically conductive metal oxide and notably made of ITO, comprising the following steps consisting in: (i) bringing into contact said surface with a solution containing copper ions (Cu.sup.2+) and ammonia then washing and optionally drying the surface thus obtained; and (ii) bringing into contact the surface obtained following step (i) with a solution containing sodium tetraborohydride then washing and optionally drying the surface of said conductive metal oxide substrate. The present invention relates to the use of such a method within the scope of the metallisation by copper of a conductive metal oxide substrate as well as the surfaces of a modified and metallised conductive metal oxide substrate thus obtained.

METHOD FOR MODIFYING AN ELECTRICALLY CONDUCTIVE OXIDE SURFACE, USE FOR ELECTRODEPOSITION OF COPPER ON SAID SURFACE

The present invention relates to a method for modifying the surface of a substrate made of electrically conductive metal oxide and notably made of ITO, comprising the following steps consisting in: (i) bringing into contact said surface with a solution containing copper ions (Cu.sup.2+) and ammonia then washing and optionally drying the surface thus obtained; and (ii) bringing into contact the surface obtained following step (i) with a solution containing sodium tetraborohydride then washing and optionally drying the surface of said conductive metal oxide substrate. The present invention relates to the use of such a method within the scope of the metallisation by copper of a conductive metal oxide substrate as well as the surfaces of a modified and metallised conductive metal oxide substrate thus obtained.

SILVER-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE COATING MATERIAL AND CONDUCTIVE SHEET EACH OF WHICH USES SAME
20170274453 · 2017-09-28 ·

Provided is a dendritic silver-coated copper powder which is capable of effectively ensuring a contact, while having excellent electrical conductivity by having the surface coated with silver. A silver-coated copper powder according to the present invention is obtained by coating the surface of a copper powder 1, which is an assembly of copper particles 2 and has a dendritic form having a plurality of branches, with silver. Each copper particle 2, the surface of which is coated with silver, is an ellipsoid that has a breadth within the range of from 0.2 μm to 0.5 μm and a length within the range of from 0.5 μm to 2.0 μm. The average particle diameter (D50) of the copper powder 1, which is obtained by coating the surface of the assembly of the ellipsoidal copper particles 2 with silver, is from 5.0 μm to 20 μm.

SILVER-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE COATING MATERIAL AND CONDUCTIVE SHEET EACH OF WHICH USES SAME
20170274453 · 2017-09-28 ·

Provided is a dendritic silver-coated copper powder which is capable of effectively ensuring a contact, while having excellent electrical conductivity by having the surface coated with silver. A silver-coated copper powder according to the present invention is obtained by coating the surface of a copper powder 1, which is an assembly of copper particles 2 and has a dendritic form having a plurality of branches, with silver. Each copper particle 2, the surface of which is coated with silver, is an ellipsoid that has a breadth within the range of from 0.2 μm to 0.5 μm and a length within the range of from 0.5 μm to 2.0 μm. The average particle diameter (D50) of the copper powder 1, which is obtained by coating the surface of the assembly of the ellipsoidal copper particles 2 with silver, is from 5.0 μm to 20 μm.

Continuous methods for treating liquids and manufacturing certain constituents (e.g., nanoparticles) in liquids, apparatuses and nanoparticles and nanoparticle/liquid solution(s) resulting therefrom

This invention relates generally to novel methods and novel devices for the continuous manufacture of nanoparticles, microparticles and nanoparticle/liquid solution(s). The nanoparticles (and/or micron-sized particles) comprise a variety of possible compositions, sizes and shapes. The particles (e.g., nanoparticles) are caused to be present (e.g., created) in a liquid (e.g., water) by, for example, preferably utilizing at least one adjustable plasma (e.g., created by at least one AC and/or DC power source), which plasma communicates with at least a portion of a surface of the liquid. At least one subsequent and/or substantially simultaneous adjustable electrochemical processing technique is also preferred. Multiple adjustable plasmas and/or adjustable electrochemical processing techniques are preferred. The continuous process causes at least one liquid to flow into, through and out of at least one trough member, such liquid being processed, conditioned and/or effected in said trough member(s). Results include constituents formed in the liquid including micron-sized particles and/or nanoparticles (e.g., metallic-based nanoparticles) of novel size, shape, composition and properties present in a liquid.

Continuous methods for treating liquids and manufacturing certain constituents (e.g., nanoparticles) in liquids, apparatuses and nanoparticles and nanoparticle/liquid solution(s) resulting therefrom

This invention relates generally to novel methods and novel devices for the continuous manufacture of nanoparticles, microparticles and nanoparticle/liquid solution(s). The nanoparticles (and/or micron-sized particles) comprise a variety of possible compositions, sizes and shapes. The particles (e.g., nanoparticles) are caused to be present (e.g., created) in a liquid (e.g., water) by, for example, preferably utilizing at least one adjustable plasma (e.g., created by at least one AC and/or DC power source), which plasma communicates with at least a portion of a surface of the liquid. At least one subsequent and/or substantially simultaneous adjustable electrochemical processing technique is also preferred. Multiple adjustable plasmas and/or adjustable electrochemical processing techniques are preferred. The continuous process causes at least one liquid to flow into, through and out of at least one trough member, such liquid being processed, conditioned and/or effected in said trough member(s). Results include constituents formed in the liquid including micron-sized particles and/or nanoparticles (e.g., metallic-based nanoparticles) of novel size, shape, composition and properties present in a liquid.