Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

A system for fabricating an object includes an additive manufacturing apparatus configured to build a three dimensional (3D) tool by additively depositing two or more layers of material. The system includes a deposition apparatus configured to deposit at least one metal on the 3D tool to form the object on the 3D tool. The system includes a burnout apparatus configured to heat the 3D tool to remove the 3D tool from the object.

RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

The invention relates to a microarray structure that may include a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material. The structure may include accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalisable areas may be part of the continuous 3D surface layer and may be isolated by the inert material but interconnected within the structure by the continuous 3D surface layer.

Method for manufacturing a horology component, including manufacturing (E1) a first structure (10) from a first photosensitive resin (31) having at least one layer of photosensitive resin having a first pattern obtained by polymerizing the first photosensitive resin by irradiation through at least one mask (4), then developing the first photosensitive resin; and transforming (E2) the first structure (10) into a second structure (1) by structuring at least one surface of the first structure by the addition of a second photosensitive resin (32) to the at least one surface, the second structure (1) being intended to at least partially form a manufacturing mold for the horology component.

A composite metal porous body according to an aspect of the present invention has a framework of a three-dimensional network structure. The framework includes a porous base material and a metal film coated on the surface of the porous base material. The metal film contains titanium metal or titanium alloy as the main component.

A method of forming a component by an electroforming process using an electroforming apparatus is presented. The electroforming apparatus includes an anode, a cathode and an electrolyte including a metal salt. The method includes receiving a set of training electroforming process parameters; training a machine learning algorithm based on at least a subset of the set of training electroforming process parameters; generating a set of updated operating electroforming parameters from the trained machine learning algorithm; and operating the electroforming apparatus based on the set of updated operating electroforming parameters. The step of operating the electroforming apparatus includes applying an electric current between the anode and the cathode in the presence of the electrolyte and depositing a plurality of metal layers on a cathode surface to form the component. A system of forming a component is also presented.

Aspects of the disclosure generally relate to an electroforming apparatus and method, including a support frame with at least one anode housing having a predetermined housing geometry. At least one anode can be carried by the at least one anode housing, and the at least one anode can also include a predetermined geometry.

Systems and methods are directed to contacts for an infrared detector. For example, an infrared imaging device includes a substrate having a first metal layer and an infrared detector array coupled to the substrate via a plurality of contacts. Each contact includes for an embodiment a plurality of metal studs each having a first end and a second end and each disposed between the first metal layer and a second metal layer, wherein the first end of each metal stud is disposed on a portion of the first metal layer that is at least partially on the surface of the substrate.

Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.