A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 m or more, diameters of 10 m or below, and inter-pillar spacing below 20 m. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.

A container structure having one or more sections and a method for manufacturing such a structure is provided. Using an additive manufacturing process, a mold material is applied to produce a shaped substrate in the form of the desired sections and/or structure. Multiple reinforcement members are disposed within the substrate and extend between and are at least partially exposed at the inner and outer substrate surfaces. A coating material is applied to the inner and outer substrate surfaces and bonds to the exposed portions of the reinforcement members. The mold material is removed and replaced with another material among the reinforcement members between the substrate coatings.

A hydrogel is formed by a reaction which is induced, in an electrolytic solution, by an electrode product electrochemically generated by electrodes installed in the electrolytic solution. An apparatus including an electrolytic tank with a bottom surface on which a two-dimensional array of working electrodes is provided and a counter electrode installed in the electrolytic tank is prepared. An electrolytic solution containing a dissolved substance that causes electrolytic deposition of a hydrogel is housed in the electrolytic tank. By applying a predetermined voltage to one or more selected working electrodes of the two-dimensional array, a hydrogel with a two-dimensional pattern corresponding to the arrangement of the selected working electrodes is formed.

Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.

The present invention relates to methods and systems that utilize a catalyst or thin metal film by atomic level deposition (ALD) of one or more metals that allows fine traces deposition to the trench formed in a dielectric material, thereby minimizing potential physical damage due to embedded conductor format and making the fine space between traces to prevent electromigration in the traces.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

Probe array formation embodiments of the invention (e.g., that are used to form full arrays or multi-probe subarrays that are to be assembled into full arrays) provide simultaneous formation of many probes of an array or subarray while the probes are in an array configuration. These embodiments provide for the creation and deformation of array formation templates that include holes or openings for depositing probe material wherein the openings are either fully formed (i.e. fully actualized) prior to deformation or are latently formed by chemical or structural changes to the template material

Improved probe arrays (e.g. buckling beam arrays) are formed using probe preforms that have desired array spacings but not intended individual probe configurations. Groups of preforms are engaged with one or more deformation plates that cause permanent (i.e. plastic) deformation of the probe preforms to provide probe from deformed probe preforms with desired probe configurations where at least part of the deformation of multiple probe preforms occur simultaneously and where multiple deformations of individual probe preforms may occur in parallel or in series and where deformation is provided by substantially lateral displacement of the one or more deformation plates relative to a permanent or temporary array substrate or one or more different deformation plates. In some variations, the substantial lateral displacement may be accompanied by longitudinal shifting as necessary to accommodate for change in relative longitudinal positioning as lateral displacement occurs.

Methods and apparatus for producing helix windings used for a transformer are provided. For example, apparatus comprise an electrically conductive mandrel comprising an elongated body, a head comprising an eyelet detail, and a winding structure disposed along the elongated body.