A method for preparing a copper-based graphene/aluminum composite wire with high electrical conductivity is disclosed. An electrodeposition solution for the wire includes the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.005 wt % to 0.020 wt % of benzalacetone, 2 wt % to 5 wt % of NaCl, 0.08 wt % to 0.5 wt % of graphene, 0.003 wt % to 0.016 wt % of N,N-dimethylformamide (DMF), and the balance of deionized water. The preparation process of the wire is composed of: electrodeposition, drawing, and annealing. The obtained wire has excellent electrical conductivity and tensile strength, which can effectively improve the electric power transmission efficiency and reduce the electrical power loss. By the above electrodeposition solution and simple preparation method, a utility model wire with high transmission efficiency can be prepared, where the comprehensive performance and microstructure of the composite can be ensured by controlling process parameters.

A method for preparing a copper-based graphene/aluminum composite wire with high electrical conductivity is disclosed. An electrodeposition solution for the wire includes the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.005 wt % to 0.020 wt % of benzalacetone, 2 wt % to 5 wt % of NaCl, 0.08 wt % to 0.5 wt % of graphene, 0.003 wt % to 0.016 wt % of N,N-dimethylformamide (DMF), and the balance of deionized water. The preparation process of the wire is composed of: electrodeposition, drawing, and annealing. The obtained wire has excellent electrical conductivity and tensile strength, which can effectively improve the electric power transmission efficiency and reduce the electrical power loss. By the above electrodeposition solution and simple preparation method, a utility model wire with high transmission efficiency can be prepared, where the comprehensive performance and microstructure of the composite can be ensured by controlling process parameters.

Provided in one embodiment of the present disclosure is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.

Disclosed is a technical idea of forming ruthenium and ruthenium-cobalt alloy nanowires having various diameters using electroplating. More particularly, a technology of forming ruthenium and ruthenium-cobalt alloy nanowires on a porous template, on pores of which nanotubes are deposited using atomic layer deposition (ALD), using electroplating, and annealing the ruthenium and ruthenium-cobalt alloy nanowires to form ruthenium-cobalt alloy nanowires having various diameters.

Disclosed herein relates to a copper foil having a low roughness property by roughening a matte side, wherein a thickness of the copper foil is from 5 μm to 70 μm, and profilometer-measured mean roughness of the roughened surface of the copper foil is from 0.5 μm to 2.0 μm, and wherein profilometer-measured mean roughness Rz JIS of the roughened matte side of the copper foil is lower than that of a shiny side of the copper foil. The copper foil provided in the present invention has excellent adhesion with a resin and an electrical property while having low roughness through surface roughening.

Disclosed herein relates to a copper foil having a low roughness property by roughening a matte side, wherein a thickness of the copper foil is from 5 μm to 70 μm, and profilometer-measured mean roughness of the roughened surface of the copper foil is from 0.5 μm to 2.0 μm, and wherein profilometer-measured mean roughness Rz JIS of the roughened matte side of the copper foil is lower than that of a shiny side of the copper foil. The copper foil provided in the present invention has excellent adhesion with a resin and an electrical property while having low roughness through surface roughening.

[Object]

To provide a current collector for battery, having a strength sufficient to suppress breakage and tears during production feared in association with thinning, and a battery having the current collector.

[Solving Means]

The current collector for battery according to the present invention has at least a first metal layer containing at least a metal selected from Cu, Fe, and Ni, and a second metal layer laminated on the first metal layer and containing at least a metal selected from Cu, Fe, and Ni other than the metal of the first metal layer. One of the first metal layer and the second metal layer contains the Ni, and a laminate interface between the first metal layer and the second metal layer has a roughness Ra≥0.12.

Disclosed are a cobalt-tungsten alloy and a method of fabricating the same. More particularly, cobalt-tungsten alloy nanowires according to an embodiment are formed using an electroplating method, a grain structure of the cobalt-tungsten alloy nanowires is controlled according to the content of tungsten, and the electrical resistivity of the cobalt-tungsten alloy nanowires can be reduced through annealing.

A nanowire structure is manufactured by forming islands of conductive material on a substrate, and a conductive sacrificial layer in the space between conductive islands. The conductive islands include an anodic etch barrier layer. An anodizable layer is formed, over the conductive islands and sacrificial layer, and anodized to form a porous template. Nanowires are formed in regions of the porous template that overlie the conductive islands. Removal of the porous template and sacrificial layer leaves a nanowire structure including isolated groups of nanowires connected to respective conductive islands which function as current collectors. Respective stacks of conductive and insulator layers are formed over different groups of the nanowires to form respective capacitors that are electrically isolated from one another. A monolithic component may thus be formed including an array of isolated capacitors formed over nanowires.

An embodiment of the present disclosure provides an electrolytic copper foil, which comprises a copper layer and has a valley mean roughness of 0.8 to 12.5, a texture coefficient of (220) face (TC(220)) of 0.49 to 1.28, a tensile strength of 25 to 51 kgf/mm2, and a weight deviation in lateral direction of 3% or less.