A method of depositing a high entropy alloy onto an electrode surface is provided. The method includes providing a bath including a plurality of ions of a plurality of metals. The method further includes submerging, at least partially, an electrode including an electrode surface in the bath. The method further includes applying a voltage to the electrode to form a high entropy alloy on the electrode surface.

An electrolytic copper foil is provided, in which the average grain size of the electrolytic copper foil in cross-section measured by electron back scattered diffraction (EBSD) is 1 μm or less in diameter. Moreover, in an X-ray diffraction (XRD) pattern of a first surface of the electrolytic copper foil measured by X-ray diffraction, a ratio of the diffraction peak intensity of (111) crystal plane to the sum of the diffraction peak intensities of (111) crystal plane, (200) crystal plane, (220) crystal plane, and (311) crystal plane is 0.5 or more.

An electrolytic copper foil is provided, in which the average grain size of the electrolytic copper foil in cross-section measured by electron back scattered diffraction (EBSD) is 1 μm or less in diameter. Moreover, in an X-ray diffraction (XRD) pattern of a first surface of the electrolytic copper foil measured by X-ray diffraction, a ratio of the diffraction peak intensity of (111) crystal plane to the sum of the diffraction peak intensities of (111) crystal plane, (200) crystal plane, (220) crystal plane, and (311) crystal plane is 0.5 or more.

A tab, a preparation method thereof, and a battery including the tab are disclosed. The tab is a copper foil material, a surface of the copper foil material having a large compressive stress is an S surface, a surface having a small compressive stress is an M surface, and only the M surface is provided with an indentation or a reinforcing rib. In the preparation method of the tab of the disclosure, the S surface/M surface of the copper foil material are identified, and it is ensured that a feed direction is oriented so that the M surface faces outward (or inward), and winding/unwinding directions of each process and a mounting direction of an embossing device are reasonably fixed, so as to ensure that a tab emboss pattern of a product is pressed on the M surface of the copper foil material rather than the S surface or both surfaces.

Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.

A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface.

A metal foam-based filtration system and method for removing sub-micron particles and contaminants from a gas or fluid flow with the use of ultralow density metal nanowire meshes that have nanometer to micron scale pores for trapping air/fluid-borne particulates. Filters can use metal foams and coated metal foams alone or in tandem. The size and density of pores in the foam can be adjusted with synthesis conditions. Foams with pore size gradients promote the trapping of different sized particulates at different regions of a foam. Multiple rounds of electrodeposition may be applied to increase the surface area and curvature of a nanowire mesh and strengthen the mesh to make it self-supporting, free-standing and capable of supporting a much heavier mass without collapse. A metal and/or a coated metal foam can act as a catalyst or substrate for absorption or adsorption to capture target particles and/or contaminants.

A metal foam-based filtration system and method for removing sub-micron particles and contaminants from a gas or fluid flow with the use of ultralow density metal nanowire meshes that have nanometer to micron scale pores for trapping air/fluid-borne particulates. Filters can use metal foams and coated metal foams alone or in tandem. The size and density of pores in the foam can be adjusted with synthesis conditions. Foams with pore size gradients promote the trapping of different sized particulates at different regions of a foam. Multiple rounds of electrodeposition may be applied to increase the surface area and curvature of a nanowire mesh and strengthen the mesh to make it self-supporting, free-standing and capable of supporting a much heavier mass without collapse. A metal and/or a coated metal foam can act as a catalyst or substrate for absorption or adsorption to capture target particles and/or contaminants.

The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, the thickness is 10 μm or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing a heavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.

A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off. In addition, the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer, so that the barrier layer is not easy to separate from the carrier layer, and peeling between the barrier layer and the carrier layer is prevented.