Patent classifications
C25D1/04
ELECTROLYTIC COPPER FOIL HAVING HIGH TENSILE STRENGTH AND SECONDARY BATTERY COMPRISING THE SAME
An electrolytic copper foil securing high strength characteristics such as tensile strength is disclosed. The electrolytic copper foil can secure high strength characteristics by maintaining an area ratio of fine grains and grain boundaries in the electrolytic copper foil even after high-temperature heat treatment. An electrode for a secondary battery including the electrolytic copper foil, and a secondary battery including the electrode are also disclosed.
ELECTROLYTIC COPPER FOIL AND SECONDARY BATTERY COMPRISING THE SAME
An electrolytic copper foil having improved elongation and electrical conductivity is disclosed. The improved elongation and electrical conductivity are due to an increase in shape deformation of grains selective to a specific direction and an increase in an average grain size after heat treatment. An electrode for a secondary battery including the electrolytic copper foil, and a secondary battery including the electrode are disclosed.
DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF
A double layered electrolytic copper foil is disclosed. It is possible to freely control various physical properties of the double layered electrolytic copper foil. The double layered electrolytic copper foil contains a first copper layer, a second copper layer, and an interface formed between one surface of the first copper layer and one surface of the second copper layer. A method of manufacturing the double layered electrolytic copper foil is also disclosed.
DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREOF
A double layered electrolytic copper foil is disclosed. It is possible to freely control various physical properties of the double layered electrolytic copper foil. The double layered electrolytic copper foil contains a first copper layer, a second copper layer, and an interface formed between one surface of the first copper layer and one surface of the second copper layer. A method of manufacturing the double layered electrolytic copper foil is also disclosed.
CELL-TO-CELL INTERCONNECT
A metallic article for a photovoltaic cell is disclosed. The metallic article includes a first region having a plurality of electroformed elements that are configured to serve as an electrical conduit for a light-incident surface of the photovoltaic cell. A cell-to-cell interconnect is integral with the first region. The cell-to-cell interconnect is configured to extend beyond the light-incident surface and to directly couple the metallic article to a neighboring photovoltaic cell. The cell-to-cell interconnect includes a plurality of electroformed, curved appendages. Each appendage has a first end coupled to an edge of the first region and a second end opposite the first end and away from the edge. The appendages are spaced apart from each other. The metallic article is a unitary, free-standing piece.
Fe-P-Cr ALLOY THIN PLATE AND METHOD FOR MANUFACTURING SAME
The present invention relates to an Fe—P—Cr alloy thin plate and a method for manufacturing the same. An embodiment of the present invention provides an Fe—P—Cr alloy thin plate including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities.
COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS
A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.
COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS
A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.
Surface-treated copper foil, and copper-clad laminate and circuit board using same
Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm.sup.−1 to less than 0.0300 nm.sup.−1.
LITHIUM ION SECONDARY BATTERY
A lithium ion secondary battery is provided. The lithium ion secondary battery includes an electrolytic tank having an accommodating space, a positive electrode disposed in the accommodating space, a negative electrode disposed in the accommodating space and spaced apart from the positive electrode, and an isolation film disposed between the positive electrode and the negative electrode. In the X-ray diffraction spectrum of a first surface of the electrolytic copper foil, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. A ratio of the diffraction peak intensity I(200) of the (200) crystal face of a second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is between 0.5 and 2.0.