Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y950 and y23x1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y950 and y23x1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y950 and y23x1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisifies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure. An electrically insulating sheet covers at least a portion of the base structure and defines a fluid passage where the component is to be located.

An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure. An electrically insulating sheet covers at least a portion of the base structure and defines a fluid passage where the component is to be located.

An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure that defines a fluid passage. The first housing can include a dissolution reservoir containing an electrolytic fluid that is fluidly coupled to the fluid passage of the second housing.

An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure that defines a fluid passage. The first housing can include a dissolution reservoir containing an electrolytic fluid that is fluidly coupled to the fluid passage of the second housing.

Systems and methods are provided for rapidly producing complex aircraft assembly tools using a meltable substrate and electrodeposition. One embodiment is a method that includes forming a meltable substrate into a model that corresponds with a shape of the aircraft assembly tool, wherein the meltable substrate is integrated with an electrically conductive material. The method also includes electrodepositing metal onto the outer surface of the model to form a metal frame having the shape of the aircraft assembly tool, the metal frame having at least one hole. The method further includes melting the model to remove the meltable substrate and the electrically conductive material from the metal frame via the hole to form a hollow metal tool having the shape of the aircraft assembly tool.

Systems and methods are provided for rapidly producing complex aircraft assembly tools using a meltable substrate and electrodeposition. One embodiment is a method that includes forming a meltable substrate into a model that corresponds with a shape of the aircraft assembly tool, wherein the meltable substrate is integrated with an electrically conductive material. The method also includes electrodepositing metal onto the outer surface of the model to form a metal frame having the shape of the aircraft assembly tool, the metal frame having at least one hole. The method further includes melting the model to remove the meltable substrate and the electrically conductive material from the metal frame via the hole to form a hollow metal tool having the shape of the aircraft assembly tool.