Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y?950 and y?23x?1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

Described herein are electrochemical-additive manufacturing (ECAM) systems comprising electrophoretically-deposited masks selectively covering a set of individually-addressable electrodes (pixels) in the electrode arrays (printheads). For example, an electrophoretically-deposited mask, comprising one or more patches, can be used to block the electric current through certain array portions thereby preventing electrolytic deposition on the corresponding portions of the deposition electrode during ECAM processes. In some examples, electrode array portions can be masked to cover damaged portions (e.g., stuck-on control circuits, electrically and/or ionically conductive passages in the electrode array) and/or to form special patterns of inactive array portions (that no longer need to be controlled using deposition control circuits). Such electrophoretically-deposited masks can be formed in an ECAM system or an external system. The mask forming can be a single-stage process or a multi-stage process. Furthermore, the mask position can be self-defining, e.g., based on defect location and/or severity of defects.

Described herein are electrochemical-additive manufacturing (ECAM) systems comprising electrophoretically-deposited masks selectively covering a set of individually-addressable electrodes (pixels) in the electrode arrays (printheads). For example, an electrophoretically-deposited mask, comprising one or more patches, can be used to block the electric current through certain array portions thereby preventing electrolytic deposition on the corresponding portions of the deposition electrode during ECAM processes. In some examples, electrode array portions can be masked to cover damaged portions (e.g., stuck-on control circuits, electrically and/or ionically conductive passages in the electrode array) and/or to form special patterns of inactive array portions (that no longer need to be controlled using deposition control circuits). Such electrophoretically-deposited masks can be formed in an ECAM system or an external system. The mask forming can be a single-stage process or a multi-stage process. Furthermore, the mask position can be self-defining, e.g., based on defect location and/or severity of defects.

The present disclosure provides a metal structure made from an anodic oxide film and a method of manufacturing the same.

The present disclosure provides a metal structure made from an anodic oxide film and a method of manufacturing the same.

A mask for deposition and a manufacturing method thereof are disclosed in aspects of the present disclosure. The disclosed mask for deposition and the manufacturing method thereof include: a deposition part including a plurality of deposition patterns; a peripheral part configured to surround the outside of the deposition part; and at least one extending part provided at the boundary between the deposition part and the peripheral part, wherein the extending part has a thickness smaller than that of the peripheral part. Accordingly, it is possible to enhance the strength of the boundary portion between the peripheral part and the deposition part of the mask for deposition.

A mask for deposition and a manufacturing method thereof are disclosed in aspects of the present disclosure. The disclosed mask for deposition and the manufacturing method thereof include: a deposition part including a plurality of deposition patterns; a peripheral part configured to surround the outside of the deposition part; and at least one extending part provided at the boundary between the deposition part and the peripheral part, wherein the extending part has a thickness smaller than that of the peripheral part. Accordingly, it is possible to enhance the strength of the boundary portion between the peripheral part and the deposition part of the mask for deposition.

A high-aspect ratio structure production method and an ultrasonic probe production method of the present invention include: forming, in a principal surface of a substrate, a plurality of pores each extending in a direction intersecting the principal surface; plugging, among the plurality of pores, one or more pores formed in a first region; and forming a recess in a second region by a wet etching process. A high-aspect ratio structure includes a grating having a plurality of convex portions, wherein each of the plurality of convex portions is provided with a plugging member plugging a plurality of pores formed therein in a thickness direction of the structure.

A high-aspect ratio structure production method and an ultrasonic probe production method of the present invention include: forming, in a principal surface of a substrate, a plurality of pores each extending in a direction intersecting the principal surface; plugging, among the plurality of pores, one or more pores formed in a first region; and forming a recess in a second region by a wet etching process. A high-aspect ratio structure includes a grating having a plurality of convex portions, wherein each of the plurality of convex portions is provided with a plugging member plugging a plurality of pores formed therein in a thickness direction of the structure.