An electrochemical plating (ECP) system is provided. The ECP system includes an ECP cell comprising a plating solution for an ECP process, a sensor configured to in situ measure an interface resistance between a plated metal and an electrolyte in the plating solution as the ECP process continues, a plating solution supply system in fluid communication with the ECP cell and configured to supply the plating solution to the ECP cell, and a control system operably coupled to the ECP cell, the sensor and the plating solution supply system. The control system is configured to compare the interface resistance with a threshold resistance and to adjust a composition of the plating solution in response to the interface resistance being below the threshold resistance.

Disclosed is a technical idea of forming ruthenium and ruthenium-cobalt alloy nanowires having various diameters using electroplating. More particularly, a technology of forming ruthenium and ruthenium-cobalt alloy nanowires on a porous template, on pores of which nanotubes are deposited using atomic layer deposition (ALD), using electroplating, and annealing the ruthenium and ruthenium-cobalt alloy nanowires to form ruthenium-cobalt alloy nanowires having various diameters.

Disclosed is a technical idea of forming ruthenium and ruthenium-cobalt alloy nanowires having various diameters using electroplating. More particularly, a technology of forming ruthenium and ruthenium-cobalt alloy nanowires on a porous template, on pores of which nanotubes are deposited using atomic layer deposition (ALD), using electroplating, and annealing the ruthenium and ruthenium-cobalt alloy nanowires to form ruthenium-cobalt alloy nanowires having various diameters.

A seeded substrate is first prepared. The seeded substrate includes an insulation substrate having a main surface composed of a first region and a second region other than the first region, and a conductive seed layer provided on the first region. Subsequently, a conductive layer is formed on at least the second region to obtain a first treated substrate. An insulation layer is then formed on the first treated substrate. The seed layer is then exposed. A metal layer is then formed on the surface of the seed layer. Here, a voltage is applied between the anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing solution being disposed between the second treated substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the insulation layer and the conductive layer are removed.

Methods and systems for scalable production of lithium metal through electrodeposition.

Methods and systems for scalable production of lithium metal through electrodeposition.

Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.

Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.

A method of electroplating a target electrode comprises establishing a first electric current through an electrolytic solution, comprising a quantity of an electrically charged material, an initial electrode, and a transitional electrode, so that a quantity of the electrically charged material is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the transitional electrode; and establishing a second electric current through the electrolytic solution, the transitional electrode, and the target electrode so that a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of the target electrode.

A method of electroplating a target electrode comprises establishing a first electric current through an electrolytic solution, comprising a quantity of an electrically charged material, an initial electrode, and a transitional electrode, so that a quantity of the electrically charged material is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the transitional electrode; and establishing a second electric current through the electrolytic solution, the transitional electrode, and the target electrode so that a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of the target electrode.