An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.

An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.

A selectively chrome plated object having a substantially flush interface comprises a first portion formed by injection molding a plateable resin and defining a first top surface, a second portion formed by injection molding a non-plateable resin and defining a second top surface, the second portion sitting proud of the first portion such that the second top surface of the second portion is offset from the first top surface of the first portion, and a third portion formed by a chrome plating process where a chrome plating is applied to the first top surface of the first portion such that a third top surface of the third portion is substantially flush with the second top surface of the second portion.

A selectively chrome plated object having a substantially flush interface comprises a first portion formed by injection molding a plateable resin and defining a first top surface, a second portion formed by injection molding a non-plateable resin and defining a second top surface, the second portion sitting proud of the first portion such that the second top surface of the second portion is offset from the first top surface of the first portion, and a third portion formed by a chrome plating process where a chrome plating is applied to the first top surface of the first portion such that a third top surface of the third portion is substantially flush with the second top surface of the second portion.

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.

A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.

A partially plated plastic product includes a first base member and a second base member that are made of different plastic materials. The first base member includes a first corner portion having a curved wall surface. The second base member includes a second corner portion. The first and second corner portions are located on a front side of the product. The first and second base members are adjacent to each other at least at the first corner portion and the second corner portion. Only one of the first and second base members includes a metal coating film formed on a region of an outer surface of the base member with which the other base member is not in contact. The second corner portion includes a groove forming portion. The groove forming portion forms a groove between itself and at least the curved wall surface of the first corner portion.

A method of removing copper oxide from copper surfaces is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.

In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.