Disclosed are a device and a method for microelectrodeposition through a laser assisted flexible following tool electrode. Localization of electrodeposition and dimensional precision of members are enhanced by using the flexible following tool electrode to restrict a dispersion region of an electric field and a reaction region of electrodeposition, and a complex-shaped member can be deposited by controlling a motion path of the flexible following tool electrode. Since a laser has a high power density, introducing laser irradiation changes an electrode state in a radiated region, accelerates ion diffusion and electron transfer speeds, and increases a deposition rate, thus reducing defects such as pitting and cracking in a deposit, enhancing deposition quality, and achieving fabrication of a micro-part by a synergistic action of both electrochemical energy and laser energy.

Disclosed are a device and a method for microelectrodeposition through a laser assisted flexible following tool electrode. Localization of electrodeposition and dimensional precision of members are enhanced by using the flexible following tool electrode to restrict a dispersion region of an electric field and a reaction region of electrodeposition, and a complex-shaped member can be deposited by controlling a motion path of the flexible following tool electrode. Since a laser has a high power density, introducing laser irradiation changes an electrode state in a radiated region, accelerates ion diffusion and electron transfer speeds, and increases a deposition rate, thus reducing defects such as pitting and cracking in a deposit, enhancing deposition quality, and achieving fabrication of a micro-part by a synergistic action of both electrochemical energy and laser energy.

The present disclosure concerns an array of chemical and electrochemical treatment cells. The cells include electrochemical cells that individually include a plating tank, a power supply, and an anode. A flight bar for supporting a cathode is moved from one tank to another for treating and plating a cathode surface. Within an electrochemical tank, the power supply operates a circuit with metal ions being eroded from the anode and being deposited onto the cathode surface. A plating apparatus is configured to simultaneously provide mechanical support, a cathodic connection, and agitation to a cathode in a plating tank. The plating apparatus includes an agitator which rotates the cathode about a fixed pivot connection to provide motion along a lateral axis and a vertical axis.

The present disclosure concerns an array of chemical and electrochemical treatment cells. The cells include electrochemical cells that individually include a plating tank, a power supply, and an anode. A flight bar for supporting a cathode is moved from one tank to another for treating and plating a cathode surface. Within an electrochemical tank, the power supply operates a circuit with metal ions being eroded from the anode and being deposited onto the cathode surface. A plating apparatus is configured to simultaneously provide mechanical support, a cathodic connection, and agitation to a cathode in a plating tank. The plating apparatus includes an agitator which rotates the cathode about a fixed pivot connection to provide motion along a lateral axis and a vertical axis.

An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).

A tin alloy electroplating bath, wherein the tin alloy electroplating bath includes (A) a soluble tin salt, (B) a soluble nickel salt and/or a soluble cobalt salt, (C) an oxycarboxylic acid or a salt thereof, (D) a nitrogen-containing heterocyclic unsaturated compound, and (E) a surfactant, and the pH of the tin alloy electroplating bath is 3 to 7.

A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25° C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2≠T1. A device for carrying out this method is also disclosed.

A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25° C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2≠T1. A device for carrying out this method is also disclosed.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller. in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller. in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.