Patent classifications
C25D5/08
METHOD AND APPARATUS FOR ELECTROPLATING
A process for the continuous application of metallic layers on a body comprising providing an electrically conductive body having a surface with an outer surface area; providing a plating apparatus comprising a cylindrical, hollow anode having an internal volume and an inner surface area, an electrolyte having metal ions dissolved therein, a cathode; imparting a charge on said body using said cathode, generating an electrical field by applying an electrical current to said anode, feeding said electrolyte into said internal volume of said anode, feeding said body through said anode, such that said body contacts said electrolyte, whereby said ions plate onto said body, forming a metallic layer on the surface of said body, and withdrawing said body from the anode; wherein a ratio of said anode inner surface area to said body outer surface area is in the range between 2.6:1 to 26:1.
METHOD AND APPARATUS FOR ELECTROPLATING
A process for the continuous application of metallic layers on a body comprising providing an electrically conductive body having a surface with an outer surface area; providing a plating apparatus comprising a cylindrical, hollow anode having an internal volume and an inner surface area, an electrolyte having metal ions dissolved therein, a cathode; imparting a charge on said body using said cathode, generating an electrical field by applying an electrical current to said anode, feeding said electrolyte into said internal volume of said anode, feeding said body through said anode, such that said body contacts said electrolyte, whereby said ions plate onto said body, forming a metallic layer on the surface of said body, and withdrawing said body from the anode; wherein a ratio of said anode inner surface area to said body outer surface area is in the range between 2.6:1 to 26:1.
Nozzle device
A nozzle device includes a nozzle body and at least one second electrode. The nozzle body extends along a longitudinal axis, and has a top surface, a bottom surface for confronting a first electrode of a workpiece, a recess provided in the bottom surface, and a longitudinal channel extending downwardly from the top surface along the longitudinal axis to be in fluid communication with the recess. The longitudinal channel has an upper section and a lower tapered section which is tapered downwardly to form a lower communication port. The least one second electrode is disposed in the recess for being spaced apart from the first electrode.
Nozzle device
A nozzle device includes a nozzle body and at least one second electrode. The nozzle body extends along a longitudinal axis, and has a top surface, a bottom surface for confronting a first electrode of a workpiece, a recess provided in the bottom surface, and a longitudinal channel extending downwardly from the top surface along the longitudinal axis to be in fluid communication with the recess. The longitudinal channel has an upper section and a lower tapered section which is tapered downwardly to form a lower communication port. The least one second electrode is disposed in the recess for being spaced apart from the first electrode.
Electrolytic processing jig and electrolytic processing method
An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.
Electrolytic processing jig and electrolytic processing method
An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.
LEAK CHECK METHOD, LEAK CHECK APPARATUS, PLATING METHOD, AND PLATING APPARATUS
A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.
COMPOSITE PROCESSING METHOD AND DEVICE FOR TEXTURE ON INNER SURFACE OF BEARING SHELL OF RADIAL SLIDING BEARING
The present invention provides a composite processing method and device for a texture on an inner surface of a bearing shell of a radial sliding bearing. A surface of a workpiece to be processed is processed by laser to obtain a micron-level texture, an obtained workpiece with the micron-level texture on a surface is placed on a compression device, and the workpiece with the micron-level texture on the surface is subjected to an electro-deposition reaction to obtain a workpiece with a nano-level texture on a surface. The processing device includes an inner spin-printing electrode electrochemical deposition system, a laser irradiation system and a motion control system. The inner spin-printing electrode electrochemical deposition system includes the inner spin-printing electrode, a direct current power supply, the bearing shell and a compression roller.
Display apparatus, apparatus and method of manufacturing display apparatus
Provided are a display apparatus and an apparatus and method of manufacturing the display apparatus. The apparatus for manufacturing a display apparatus includes: a dry cleansing unit configured to remove impurities from a surface of a mother substrate; an electrolyte treatment unit connected to the dry cleansing unit and configured to treat the surface of the mother substrate with electrolytes; and an exfoliated layer forming unit connected to the electrolyte treatment unit and configured to form an exfoliated layer on the mother substrate.
Apparatus for electro-chemical plating
An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.