C25D5/10

Processes for providing laminated coatings on workpieces, and articles made therefrom

Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment apparatus, as well as articles made from such processes. Embodiments of such processes involve mass-transfer modulation to provide compositionally modulated coatings.

Processes for providing laminated coatings on workpieces, and articles made therefrom

Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment apparatus, as well as articles made from such processes. Embodiments of such processes involve mass-transfer modulation to provide compositionally modulated coatings.

ELECTROPLATE LAMINATED STRUCTURE AND METHODS OF FABRICATING THE SAME

Corrosion-resistant laminated structures and methods of fabricating laminated structures are disclosed. A method of fabricating a laminated structure includes: providing an object in an electroplating solution; forming a first layer on the object by applying a first electric current, the first electric current being associated with a first current density; and forming a second layer on the first layer by applying a second electric current, the second electric current being associated with a second current density. Each of the first layer and the second layer includes, at least in part, phosphorus. The first current density and the second current density are different.

ELECTROPLATE LAMINATED STRUCTURE AND METHODS OF FABRICATING THE SAME

Corrosion-resistant laminated structures and methods of fabricating laminated structures are disclosed. A method of fabricating a laminated structure includes: providing an object in an electroplating solution; forming a first layer on the object by applying a first electric current, the first electric current being associated with a first current density; and forming a second layer on the first layer by applying a second electric current, the second electric current being associated with a second current density. Each of the first layer and the second layer includes, at least in part, phosphorus. The first current density and the second current density are different.

Electrodeposited copper foil and electrode, and lithium-ion secondary battery comprising the same

Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.

Electrodeposited copper foil and electrode, and lithium-ion secondary battery comprising the same

Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.

Manufacturing method of indium tin oxide

The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.

Manufacturing method of indium tin oxide

The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.

Fabrication Method of Flexible Cyclo-Olefin Polymer (COP) Substrate for IC Packaging of Communication Devices and Biocompatible Sensors Devices
20220181165 · 2022-06-09 ·

A method to produce a flexible substrate is described. A base film material of cyclo-olefin polymer (COP) is provided. A surface of the COP base film is irradiated with UV light to form a functional group on the COP surface. Thereafter, the surface is treated with an alkaline degreaser. Thereafter, a Ni—P seed layer is electrolessly plated on the surface. A photoresist pattern is formed on the Ni—P seed layer. Copper traces are plated within the photoresist pattern. The photoresist pattern is removed and the Ni—P seed layer not covered by the copper traces is etched away to complete the flexible substrate. Alternatively, a biocompatible flexible substrate is formed using a Ni—P seed layer with a biocompatible surface finishing instead of copper.

Method for preparing optical articles with multi-layer antireflective coatings

The present invention is directed to a method for preparing a coated optical article including providing a non-conductive substrate; forming a conductive coating layer over the substrate; electrodepositing a first electrodepositable coating composition over the conductive coating layer to form a first electrodeposited inorganic coating layer; and electrodepositing a second electrodepositable coating composition over the first electrodeposited coating layer to form a second electrodeposited inorganic coating layer thereover, thereby forming a multi-layer antireflective inorganic coating over the conductive coating layer. Each of the first electrodepositable coating composition and the second electrodepositable coating composition is different one from the other, and each includes a sol prepared from a composition of a metal oxide precursor and protic acid such that each coating composition is hydrolyzed. Coated optical articles are also provided.