Disclosed herein is a method of coating, comprising providing an article having an internal passage therein to be coated; electrolytically applying a first layer that comprises chromium or a chromium alloy onto a surface of the internal passage; electrolytically applying a second layer comprising aluminum or an aluminum alloy onto the first layer; and heat treating the article to promote interdiffusion between the first layer and the second layer.

An electroplating apparatus includes a substrate, a seed layer provided on a top surface of the substrate, a high-voltage portion provided on a bottom surface of the substrate, a housing sealing the high-voltage portion, an anode structure spaced apart from the seed layer in a direction perpendicular to the top surface of the substrate, first power source generating a first voltage difference between the seed layer and the anode structure, and a second power source applying a second voltage to the high-voltage portion. A positive terminal of the first power source is electrically connected to the anode structure, and a negative terminal of the first power source is electrically connected to the seed layer.

There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.

Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm.sup.2, a mean width of roughness profile elements (Rsm) of 18 to 148 m and a texture coefficient bias [TCB(220)] of 0.52 or less.

A terminal includes a connecting portion to be electrically connected to a mating terminal by being inserted into the mating terminal. The connecting portion has a sliding region configured to slide on the mating terminal and a contact region configured to contact the mating terminal successively from a tip side. An outermost surface in the sliding region includes a copper-tin alloy layer containing copper and tin. An outermost surface in the contact region includes a tin layer containing tin as a main component. A Vickers hardness of the copper-tin alloy layer is higher than a Vickers hardness of the tin layer.

Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 m.sup.3/m.sup.2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 m.sup.3/m.sup.2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

A steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The chromium metal layer is deposited in an amount of 65-200 mg/m.sup.2, and the hydrous chromium oxide layer is deposited in an amount of 3-15 mg/m.sup.2 in terms of chromium. The chromium metal layer includes: a flat chromium metal layer that has a thickness of at least 7 nm; and a granular chromium metal layer that includes granular protrusions that are formed on the surface of the flat chromium metal layer. The maximum grain size of the granular protrusions is 100 nm or smaller. The number density of the granular protrusions per unit area is 10/m.sup.2 or higher.

A method of electroplating a metal into a recessed feature is provided, which includes: contacting a surface of the recessed feature with an electroplating solution comprising metal ions, an accelerator additive, a suppressor additive and a leveler additive, in which the recessed feature has at least two elongated regions and a cross region laterally between the two elongated regions, and a molar concentration ratio of the accelerator additive: the suppressor additive: the leveler additive is (8-15):(1.5-3):(0.5-2); and electroplating the metal to form an electroplating layer in the recessed feature. An electroplating layer in a recessed feature is also provided.

Surface-treated copper foils comprising an electrodeposited copper foil including a drum side and a deposited side are reported. The treatment layer is disposed on one of the drum side and the deposited side and provides a surface-treated side. The treatment layer comprises a nodule layer and the surface-treated side exhibits a void volume (Vv) in a range of 0.1 to 0.9 m.sup.3/m.sup.2. The surface-treated copper foil also has a combined hydrogen and oxygen content of less than or equal to 300 ppm.