The present invention discloses a method and a device for laser-assisted electrochemical composite deposition using a rifling-type hollow rotating electrode, which relate to the field of micro-composite processing in special processing technologies. A center of a laser beam is allowed to pass through a rifling-type hollow rotating electrode and focus onto a cathode substrate. When the rifling-type hollow rotating electrode is rotated at a constant speed, an electrodeposition solution rotates in the rifling-type hollow rotating electrode and generates a certain centripetal force to improve the precision and localization of deposition. During the process of the present invention, an internal rifling structure of the electrode is rotated at a high speed so that the deposition solution generates a centripetal force. The internal rifling structure and an external helical structure of the rifling-type hollow rotating electrode make the deposition solution move upward to form a “self-circulation” system.

The present invention discloses a method and a device for laser-assisted electrochemical composite deposition using a rifling-type hollow rotating electrode, which relate to the field of micro-composite processing in special processing technologies. A center of a laser beam is allowed to pass through a rifling-type hollow rotating electrode and focus onto a cathode substrate. When the rifling-type hollow rotating electrode is rotated at a constant speed, an electrodeposition solution rotates in the rifling-type hollow rotating electrode and generates a certain centripetal force to improve the precision and localization of deposition. During the process of the present invention, an internal rifling structure of the electrode is rotated at a high speed so that the deposition solution generates a centripetal force. The internal rifling structure and an external helical structure of the rifling-type hollow rotating electrode make the deposition solution move upward to form a “self-circulation” system.

Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties.

Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties.

A Ni-plated steel sheet according to an aspect of the present invention includes: a base steel sheet; an Fe—Ni diffusion alloy region disposed on the base steel sheet; and a Ni plating region disposed on the Fe—Ni diffusion alloy region, in which an average equivalent circle diameter of crystal grains made of Ni (fcc) in the Ni plating region measured in a cross section perpendicular to a rolled surface of the base steel sheet is 0.2 to 4.0 μm.

A false report on appearance inspection of a semiconductor device is prevented by suppressing variation in surface state of an electrodeposited gold electrode. In formation of an electrodeposited gold electrode, an electrodeposited gold electrode comprised of a plurality of electrodeposited gold layers in the stack is formed by alternately repeating a step of performing energization between an anode electrode and a cathode electrode provided in a treatment cup of a plating apparatus to cause crystal growth of an electrodeposited gold layer (energization ON), and a step of performing no energization between the anode electrode and the cathode electrode (energization OFF). Consequently, even if aging variation occurs in composition of the plating solution, variation in surface state of the electrodeposited gold electrode is suppressed, and a surface state with a surface roughness of, for example, about 0.025 rad can be maintained.

A false report on appearance inspection of a semiconductor device is prevented by suppressing variation in surface state of an electrodeposited gold electrode. In formation of an electrodeposited gold electrode, an electrodeposited gold electrode comprised of a plurality of electrodeposited gold layers in the stack is formed by alternately repeating a step of performing energization between an anode electrode and a cathode electrode provided in a treatment cup of a plating apparatus to cause crystal growth of an electrodeposited gold layer (energization ON), and a step of performing no energization between the anode electrode and the cathode electrode (energization OFF). Consequently, even if aging variation occurs in composition of the plating solution, variation in surface state of the electrodeposited gold electrode is suppressed, and a surface state with a surface roughness of, for example, about 0.025 rad can be maintained.

Various aspects according to the instant disclosure relate to a method of electrodeposition of zinc. The method includes independently controlling at least one of an electrical peak current and a duty cycle. The method further includes depositing the zinc on a substrate.

Various aspects according to the instant disclosure relate to a method of electrodeposition of zinc. The method includes independently controlling at least one of an electrical peak current and a duty cycle. The method further includes depositing the zinc on a substrate.

An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.