Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Articles including a layer comprising nickel and chromium as well as related methods are described herein.

The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.

The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.

The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.

PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

Metal surface pretreatments using ionic liquids prior to electroplating are disclosed. The surface treatments include forming an activated metal substrate surface by removing any naturally formed metal oxide layers formed on the surfaces of the metal substrates. According to some embodiments, the surface treatments include exposing the metal substrate to a non-aqueous ionic liquid. In some embodiments, an electrical current is applied to the metal substrate to assist removal of the metal oxide layer. The electrical current can be a pulsed anodic current. After activating the surface, a metal layer can be deposited on the activated surface. In some embodiments, the metal layer is electrodeposited in the same ionic liquid used to form the activated surface. The resultant metal coating is resistant to scratching and peeling.

Metal surface pretreatments using ionic liquids prior to electroplating are disclosed. The surface treatments include forming an activated metal substrate surface by removing any naturally formed metal oxide layers formed on the surfaces of the metal substrates. According to some embodiments, the surface treatments include exposing the metal substrate to a non-aqueous ionic liquid. In some embodiments, an electrical current is applied to the metal substrate to assist removal of the metal oxide layer. The electrical current can be a pulsed anodic current. After activating the surface, a metal layer can be deposited on the activated surface. In some embodiments, the metal layer is electrodeposited in the same ionic liquid used to form the activated surface. The resultant metal coating is resistant to scratching and peeling.