The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.

Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

A semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece, wherein the outlet of the conduit is positioned above the major surface of the semiconductor workpiece by a vertical distance.

A semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece, wherein the outlet of the conduit is positioned above the major surface of the semiconductor workpiece by a vertical distance.

A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

A process (30) for producing a distributor plate (1) for an electrochemical system, wherein the distributor plate (1) has at least one metal foil (2) having a first surface (3) and a second surface (4) and the process (30) has the following process steps: a) pretreatment (31) of the metal foil (2); b) mask formation (32) at least on the first surface (3) of the pretreated metal foil (2); c) structure formation (33) at least on the first surface (3) of the metal foil (2) provided with the mask (10), as a result of which a first fluid distributor structure (5) is formed; d) mask removal (36).

A method of removing copper oxide from copper surfaces is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.

A method of removing copper oxide from copper surfaces is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.