The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate.

The method for a chemical and/or electrolytic surface treatment comprises the following steps, not necessarily in this order: mounting a substrate to be treated to a rotor unit, moving the rotor unit with the substrate into a pre-wetting chamber of the process station, applying a pre-wetting fluid to the substrate in the pre-wetting chamber, moving the rotor unit with the substrate at least partially out of the pre-wetting chamber, spinning the rotor unit with the substrate in a spinning plane to centrifugally reduce the pre-wetting fluid at a surface of the substrate, rotating the rotor unit with the substrate normal to the spinning plane so that the substrate faces away from the pre-wetting chamber, moving the rotor unit with the substrate into an electroplating chamber of the process station, applying an electrolyte liquid and an electric current to the substrate for an electroplating process on the substrate in the electroplating chamber, and moving the rotor unit with the substrate at least partially out of the electroplating chamber.

The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate.

The method for a chemical and/or electrolytic surface treatment comprises the following steps, not necessarily in this order: mounting a substrate to be treated to a rotor unit, moving the rotor unit with the substrate into a pre-wetting chamber of the process station, applying a pre-wetting fluid to the substrate in the pre-wetting chamber, moving the rotor unit with the substrate at least partially out of the pre-wetting chamber, spinning the rotor unit with the substrate in a spinning plane to centrifugally reduce the pre-wetting fluid at a surface of the substrate, rotating the rotor unit with the substrate normal to the spinning plane so that the substrate faces away from the pre-wetting chamber, moving the rotor unit with the substrate into an electroplating chamber of the process station, applying an electrolyte liquid and an electric current to the substrate for an electroplating process on the substrate in the electroplating chamber, and moving the rotor unit with the substrate at least partially out of the electroplating chamber.

A silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating at a current density in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzimidazole (such as 2-mercaptobenzmimidazole or 2-mercaptobenzimidazole sulfonic acid sodium salt dihydrate), the ratios of the concentrations of silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and the imidazole to the current density during the silver-plating (or the ratios of the concentrations of silver potassium cyanide or silver cyanide and the imidazole to the current density during the silver plating, and the concentration of potassium cyanide or sodium cyanide) are set to be predetermined ranges, respectively.

The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50 mg/m.sup.2 or less.

According to the present invention, provided are a high-strength cold-rolled steel sheet and a manufacturing for manufacturing same. In the high-strength cold-rolled steel sheet, a metal layer is coated on a cold-rolled steel sheet to a thickness of nanometers, followed by annealing, thereby suppressing the formation of oxides of Si, Mn, and the like on the surface of the steel sheet to within a range in which the elution of Fe is not suppressed, and thus the high-strength cold-rolled steel sheet has improved phosphatability.

The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50 mg/m.sup.2 or less.

According to the present invention, provided are a high-strength cold-rolled steel sheet and a manufacturing for manufacturing same. In the high-strength cold-rolled steel sheet, a metal layer is coated on a cold-rolled steel sheet to a thickness of nanometers, followed by annealing, thereby suppressing the formation of oxides of Si, Mn, and the like on the surface of the steel sheet to within a range in which the elution of Fe is not suppressed, and thus the high-strength cold-rolled steel sheet has improved phosphatability.

Provided are a conductive film and a preparation method for the same, which relate to the technical field of conductive films. The preparation method for the conductive film includes: forming a metal process layer on a surface of an insulating layer by means of evaporation deposition, wet electroplating or chemical plating; forming a metal transition layer on a surface of the metal process layer facing away from the insulating layer by means of magnetron sputtering; and forming a metal functional layer on a surface of the metal transition layer facing away from the metal process layer. The conductive film obtained by this preparation method can have relatively good conductivity and density while having a relatively thick metal conductive layer.

Provided are a conductive film and a preparation method for the same, which relate to the technical field of conductive films. The preparation method for the conductive film includes: forming a metal process layer on a surface of an insulating layer by means of evaporation deposition, wet electroplating or chemical plating; forming a metal transition layer on a surface of the metal process layer facing away from the insulating layer by means of magnetron sputtering; and forming a metal functional layer on a surface of the metal transition layer facing away from the metal process layer. The conductive film obtained by this preparation method can have relatively good conductivity and density while having a relatively thick metal conductive layer.

A method for manufacturing a printed wiring board includes forming through holes in a double-sided copper-clad laminated plate such that a high-density region of the through holes and a low-density region of the through holes are formed, forming an electrolytic plating film on a copper foil of the plate in the high-density and low-density regions, forming a masking resist to mask the plating film in the high-density region, etching the plating film in the low-density region exposed from the resist such that the plating film in the low-density region is thinned, peeling off the resist from the plating film in the high-density region, and forming a conductor circuit including the copper foil and the plating film in the high-density and low-density regions. The forming of the plating film on the copper foil of the plate includes forming the plating film in the through holes in the high-density and low-density regions.

A method for manufacturing a printed wiring board includes forming through holes in a double-sided copper-clad laminated plate such that a high-density region of the through holes and a low-density region of the through holes are formed, forming an electrolytic plating film on a copper foil of the plate in the high-density and low-density regions, forming a masking resist to mask the plating film in the high-density region, etching the plating film in the low-density region exposed from the resist such that the plating film in the low-density region is thinned, peeling off the resist from the plating film in the high-density region, and forming a conductor circuit including the copper foil and the plating film in the high-density and low-density regions. The forming of the plating film on the copper foil of the plate includes forming the plating film in the through holes in the high-density and low-density regions.

A method for depositing a zinc-nickel alloy on a substrate, including: (a) providing the substrate, (b) providing an aqueous zinc-nickel deposition bath as catholyte in a compartment, wherein the compartment includes an anode and anolyte, the anolyte being separated from catholyte by a membrane, and the catholyte includes nickel ions, complexing agent, zinc ions, (c) depositing zinc-nickel alloy onto the substrate, wherein after step (c) nickel ions have lower concentration than before step (c), (d) rinsing the zinc-nickel coated substrate in water, obtaining a rinsed zinc-nickel coated substrate and rinse water including a portion of the complexing agent and nickel ions, wherein (i) a portion of rinse water and/or a portion of catholyte is treated in a first treatment compartment to separate water from the complexing agent and the nickel ions, (ii) returning the separated complexing agent to the catholyte, and (iii) adding nickel ion to the catholyte.