Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

The present disclosure provides a method for producing a wiring substrate. A seeded substrate is first prepared. The seeded substrate includes an insulation substrate, a conductive undercoat layer having a hydrophilic surface and provided on the insulation substrate, a conductive seed layer provided on a first region of the surface of the undercoat layer, the first region having a predetermined pattern, and a water-repellent layer on the second region of the surface of the undercoat layer, the second region being a region other than the first region. Subsequently, a metal layer is formed on the seed layer. A voltage is applied between the anode and the seed layer while a solid electrolyte membrane being disposed between the seeded substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the water-repellent layer and the undercoat layer are etched.

The present disclosure provides a method for producing a wiring substrate. A seeded substrate is first prepared. The seeded substrate includes an insulation substrate, a conductive undercoat layer having a hydrophilic surface and provided on the insulation substrate, a conductive seed layer provided on a first region of the surface of the undercoat layer, the first region having a predetermined pattern, and a water-repellent layer on the second region of the surface of the undercoat layer, the second region being a region other than the first region. Subsequently, a metal layer is formed on the seed layer. A voltage is applied between the anode and the seed layer while a solid electrolyte membrane being disposed between the seeded substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the water-repellent layer and the undercoat layer are etched.

An exemplary embodiment relates to improving a driving speed of a shape-memory-alloy applied as an artificial muscle, and to improving heat conduction and thermal convection by growing copper nanowires on the surface of the shape-memory-alloy to improve a natural cooling rate and a driving speed of the shape-memory-alloy.

An exemplary embodiment relates to improving a driving speed of a shape-memory-alloy applied as an artificial muscle, and to improving heat conduction and thermal convection by growing copper nanowires on the surface of the shape-memory-alloy to improve a natural cooling rate and a driving speed of the shape-memory-alloy.

A method of producing an electrocatalyst, comprising the steps of: a) electrodeposition or electrochemical plating of an alloy comprising nickel and a second metal on a copper, nickel or other metal substrate; and b) electrochemical or chemical dissolution of deposited second metal to obtain a nanoporous structure on the copper, nickel or other metal substrate.

A method of producing an electrocatalyst, comprising the steps of: a) electrodeposition or electrochemical plating of an alloy comprising nickel and a second metal on a copper, nickel or other metal substrate; and b) electrochemical or chemical dissolution of deposited second metal to obtain a nanoporous structure on the copper, nickel or other metal substrate.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.