Various inventions are disclosed in the microchip manufacturing arts. Conductive pattern formation by semi-additive processes are disclosed. Further conductive patterns and methods using activated precursors are also disclosed. Aluminum laminated surfaces and methods of circuit formation therefrom are further disclosed. Circuits formed on an aluminum heat sink are also disclosed. The inventive subject matter further discloses methods of electrolytic plating by controlling surface area of an anode.

Various inventions are disclosed in the microchip manufacturing arts. Conductive pattern formation by semi-additive processes are disclosed. Further conductive patterns and methods using activated precursors are also disclosed. Aluminum laminated surfaces and methods of circuit formation therefrom are further disclosed. Circuits formed on an aluminum heat sink are also disclosed. The inventive subject matter further discloses methods of electrolytic plating by controlling surface area of an anode.

Provided is a technique that allows ensuring a downsized plating apparatus.

A plating apparatus includes a discharge module 50. The discharge module includes a module main body 51 including a plurality of nozzles 52 configured to discharge a process liquid upward, and a moving mechanism 60 including a rotation shaft 61 disposed at a side of a plating tank and connected to the module main body. The moving mechanism 60 moves the module main body by rotation of the rotation shaft. The moving mechanism moves the module main body between the first position and the second position. The plurality of nozzles are arranged such that the process liquid discharged from the plurality of nozzles is brought in contact with a lower surface of a substrate from a center portion to an outer peripheral edge portion when the module main body moves to the second position. The module main body further includes a recovery member configured to recover the process liquid dropped after being discharged from the plurality of nozzles and brought in contact with the lower surface of the substrate.

Provided is a technique that allows ensuring a downsized plating apparatus.

A plating apparatus includes a discharge module 50. The discharge module includes a module main body 51 including a plurality of nozzles 52 configured to discharge a process liquid upward, and a moving mechanism 60 including a rotation shaft 61 disposed at a side of a plating tank and connected to the module main body. The moving mechanism 60 moves the module main body by rotation of the rotation shaft. The moving mechanism moves the module main body between the first position and the second position. The plurality of nozzles are arranged such that the process liquid discharged from the plurality of nozzles is brought in contact with a lower surface of a substrate from a center portion to an outer peripheral edge portion when the module main body moves to the second position. The module main body further includes a recovery member configured to recover the process liquid dropped after being discharged from the plurality of nozzles and brought in contact with the lower surface of the substrate.

A steel sheet includes: a predetermined chemical composition; and a steel structure represented by, in area %, first martensite in which two or more iron carbides each having a circle-equivalent diameter of 2 nm to 500 nm are contained in each lath: 20% to 95%, ferrite: 15% or less, retained austenite: 15% or less, and the balance: bainite, or second martensite in which less than two iron carbides each having a circle-equivalent diameter of 2 nm to 500 nm are contained in each lath, or the both of these, in which the total area fraction of ND//<111> orientation grains and ND//<100> orientation grains is 40% or less, and the content of solid-solution C is 0.44 ppm or more.

A steel sheet includes: a predetermined chemical composition; and a steel structure represented by, in area %, first martensite in which two or more iron carbides each having a circle-equivalent diameter of 2 nm to 500 nm are contained in each lath: 20% to 95%, ferrite: 15% or less, retained austenite: 15% or less, and the balance: bainite, or second martensite in which less than two iron carbides each having a circle-equivalent diameter of 2 nm to 500 nm are contained in each lath, or the both of these, in which the total area fraction of ND//<111> orientation grains and ND//<100> orientation grains is 40% or less, and the content of solid-solution C is 0.44 ppm or more.

A surface-treated copper foil includes a treating surface, and a peak extreme height (Sxp) of the treating surface being in a range of 0.4-2.5 μm, where the hysteresis loop of the surface-treated copper foil includes a first magnetization and a second magnetization when the magnetic field strength of the hysteresis loop is zero, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-1200 emu/m.sup.3.

A decorative component includes a plurality of metal finish layers deposited over a substrate and a plurality of sub-layers. The outermost metal finish layer is selectively deposited or removed to define one or more recesses to create different appearances of the component. The outer metal layer may undergo laser ablation to remove at least a portion of the outer layer while still exposing the outer layer in the area of removed material. The recess may extend fully through the outer layer to expose the underlying metal finish layer, and/or the recess may have a sloped bottom surface to define a gradient appearance. The outer layer may be applied over a mask that is applied to the underlying layer, such that the outer layer is selectively applied. The outer layer may be removed to expose the underlying finish layer without exposing a nickel sublayer and without requiring a top coat.

An exemplary embodiment relates to improving a driving speed of a shape-memory-alloy applied as an artificial muscle, and to improving heat conduction and thermal convection by growing copper nanowires on the surface of the shape-memory-alloy to improve a natural cooling rate and a driving speed of the shape-memory-alloy.

An exemplary embodiment relates to improving a driving speed of a shape-memory-alloy applied as an artificial muscle, and to improving heat conduction and thermal convection by growing copper nanowires on the surface of the shape-memory-alloy to improve a natural cooling rate and a driving speed of the shape-memory-alloy.