Patent classifications
C25D5/48
Glass wiring board
A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.
Wet-area device and method for manufacturing wet-area device
According to one embodiment, a wet-area device includes a main part, a first layer, and a second layer. The first layer is provided on an outer surface of the main part. The second layer is provided on an outer surface of the first layer. A hardness of the second layer is greater than a hardness of the first layer. The first layer includes a first unevenness at a side of the outer surface of the first layer. The first unevenness includes a plurality of recesses and a plurality of protrusions. The second layer includes a second unevenness at a side of an outer surface of the second layer. The second unevenness includes a plurality of recesses and a plurality of protrusions. The second unevenness is arranged along the first unevenness. An average height of the first unevenness is less than an average length of the first unevenness.
METAL AIR FILTER
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with negative charges; and a power supply which supplies a positive voltage for conducting the filter with positive charges and a negative voltage for the ionizer. The filter can be more simply manufactured at a lower cost than a conventional process.
TERMINAL COMPONENT, SECONDARY BATTERY, AND METHOD FOR PRODUCING THE TERMINAL COMPONENT
A terminal component disclosed herein includes a first metal and a second metal stacked on the first metal. On the first metal, nickel is plated at least on a boundary surface with the second metal. A joining portion joined by diffusion of the metals is formed in a portion of a boundary between the first metal and the second metal.
Copper foil free from generation of wrinkles, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same
Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
Copper foil free from generation of wrinkles, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same
Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
THERMAL SPRAY WIRE
Provided is a thermal spray wire as a thermal spray material for use in continuous arc wire thermal spraying machines, the thermal spray wire being for performing continuous and stable arc thermal spraying with sufficient electrical conductivity and at a stable voltage. The thermal spray wire includes a copper-plated coating having a thickness of from 0.3 to 1.2 μm on a surface of a rod made of stainless steel. Using the thermal spray wire allows for stable arc thermal spraying by a continuous arc thermal spraying machine including a wire feeding mechanism.
THERMAL SPRAY WIRE
Provided is a thermal spray wire as a thermal spray material for use in continuous arc wire thermal spraying machines, the thermal spray wire being for performing continuous and stable arc thermal spraying with sufficient electrical conductivity and at a stable voltage. The thermal spray wire includes a copper-plated coating having a thickness of from 0.3 to 1.2 μm on a surface of a rod made of stainless steel. Using the thermal spray wire allows for stable arc thermal spraying by a continuous arc thermal spraying machine including a wire feeding mechanism.
METHODS FOR MANUFACTURING METALLIC CUTTING EDGE THROUGH ELECTRODEPOSITION
A method of manufacturing a metallic cutting member, through electrodeposition, comprises moving a dispenser filled with a metal salt solution to a first printing position, depositing a metal onto a conductive or semi-conductive substrate via the dispenser until the deposited metal contacts the dispenser, and upon detecting that the deposited metal contacts the dispenser, moving the dispenser to a second printing position.
METHODS FOR MANUFACTURING METALLIC CUTTING EDGE THROUGH ELECTRODEPOSITION
A method of manufacturing a metallic cutting member, through electrodeposition, comprises moving a dispenser filled with a metal salt solution to a first printing position, depositing a metal onto a conductive or semi-conductive substrate via the dispenser until the deposited metal contacts the dispenser, and upon detecting that the deposited metal contacts the dispenser, moving the dispenser to a second printing position.