A method of making an assembly can include juxtaposing a top surface of a first electrically conductive element at a first surface of a first substrate with a top surface of a second electrically conductive element at a major surface of a second substrate. One of: the top surface of the first conductive element can be recessed below the first surface, or the top surface of the second conductive element can be recessed below the major surface. Electrically conductive nanoparticles can be disposed between the top surfaces of the first and second conductive elements. The conductive nanoparticles can have long dimensions smaller than 100 nanometers. The method can also include elevating a temperature at least at interfaces of the juxtaposed first and second conductive elements to a joining temperature at which the conductive nanoparticles can cause metallurgical joints to form between the juxtaposed first and second conductive elements.

The present disclosure disclose a method for preparing a heat dissipation component with high flexibility made of graphite or a graphene material, which includes that follow steps: 1) plasma cleaning a graphite or graphene raw material; 2) taking preparation materials of an activator; 3) continually cleaning the graphite or graphene raw material with the activator; 4) cleaning the graphite or graphene raw material with deionized water; 5) conducting a electroplating process on a surface of the graphite or graphene raw material to form a copper film layer; 6) continually cleaning the graphite or graphene raw material; 7) forming a protective film on the graphite or graphene raw material by soaking; 8) drying the graphite or graphene raw material electroplated with the copper film layer. The surface of graphite or graphene treated with the activator has a uniform copper film layer with good binding quality during electroplating.

The present invention relates to an electrode, which is an in vivo insertable electrode, including a substrate, an electrically conductive layer formed on the substrate, a platinum black layer formed on the electrically conductive layer, a self-assembled monolayer (SAM) formed on the platinum black layer, and a lubricant layer formed on the SAM, a method of manufacturing the electrode, and a medical device including the electrode. The in vivo insertable electrode according to the present invention provides excellent electrical properties such as low impedance. Further, it shows that friction with tissue occurring when the electrode is inserted is reduced, and trauma during insertion and an immune rejection response after insertion is suppressed. Further, in the long term, it is possible to detect signals with high sensitivity throughout the entire period by preventing bioadhesion of in vivo cells, such as immune cells, and other proteins.

The present invention relates to an electrode, which is an in vivo insertable electrode, including a substrate, an electrically conductive layer formed on the substrate, a platinum black layer formed on the electrically conductive layer, a self-assembled monolayer (SAM) formed on the platinum black layer, and a lubricant layer formed on the SAM, a method of manufacturing the electrode, and a medical device including the electrode. The in vivo insertable electrode according to the present invention provides excellent electrical properties such as low impedance. Further, it shows that friction with tissue occurring when the electrode is inserted is reduced, and trauma during insertion and an immune rejection response after insertion is suppressed. Further, in the long term, it is possible to detect signals with high sensitivity throughout the entire period by preventing bioadhesion of in vivo cells, such as immune cells, and other proteins.

A method for decorating a substrate which includes the succession of the following steps: provide the substrate; deposit a layer of a sacrificial material over a surface of the substrate; structure the sacrificial material layer so as to create in this sacrificial material layer a plurality of cavities to form a decorative or technical pattern; eliminate the sacrificial material layer except at the location where the pattern is provided.

A method for decorating a substrate which includes the succession of the following steps: provide the substrate; deposit a layer of a sacrificial material over a surface of the substrate; structure the sacrificial material layer so as to create in this sacrificial material layer a plurality of cavities to form a decorative or technical pattern; eliminate the sacrificial material layer except at the location where the pattern is provided.

A method for forming a circuit board having a dielectric core, a foil top surface, and a thin foil bottom surface with a removable foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling utilizes a sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step, which provide dot vias of fine linewidth and resolution.

A Sn-plated steel sheet including a base plated steel sheet having a steel sheet, a Sn-plated layer on at least one surface of the steel sheet, and a film layer containing a zirconium oxide and a tin oxide. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m.sup.2 or more and 15 g/m.sup.2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m.sup.2 or more and 30 mg/m.sup.2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d.sub.5/2 of the tin oxide is 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is more than 5.0 mC/cm.sup.2 and 20 mC/cm.sup.2 or less.

A Sn-plated steel sheet including a base plated steel sheet having a steel sheet, a Sn-plated layer on at least one surface of the steel sheet, and a film layer containing a zirconium oxide and a tin oxide. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m.sup.2 or more and 15 g/m.sup.2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m.sup.2 or more and 30 mg/m.sup.2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d.sub.5/2 of the tin oxide is 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is more than 5.0 mC/cm.sup.2 and 20 mC/cm.sup.2 or less.

The present disclosure provides electrolyte solutions for electrodeposition of zinc-manganese alloys, methods of forming electrolyte solutions, methods of electrodepositing zinc-manganese alloys, and multilayered zinc-manganese alloys. An electrolyte solution for electroplating can include a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. An electrolyte solution can be formed by dissolving a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde in water or an aqueous solution. Electrodepositing zinc-manganese alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and manganese onto the cathode.