A plating system is provided. The plating system includes an electroplating chamber defining a plating area within which a wafer is plated. The electroplating chamber includes an inlet configured to introduce plating solution into the plating area of the electroplating chamber. The electroplating chamber includes an outlet configured to remove the plating solution from the plating area of the electroplating chamber. The plating system includes a barrier configured to inhibit removal of the plating solution from the plating area.

A plating system is provided. The plating system includes an electroplating chamber defining a plating area within which a wafer is plated. The electroplating chamber includes an inlet configured to introduce plating solution into the plating area of the electroplating chamber. The electroplating chamber includes an outlet configured to remove the plating solution from the plating area of the electroplating chamber. The plating system includes a barrier configured to inhibit removal of the plating solution from the plating area.

The present disclosure generally relates to a method for electroplating (or electrodeposition) a transition metal oxide composition that may be used in gas sensors, biological cell sensors, supercapacitors, catalysts for fuel cells and metal air batteries, nano and optoelectronic devices, filtration devices, structural components, and energy storage devices. The method includes electrodepositing the electrochemically active transition metal oxide composition onto a working electrode in an electrodeposition bath containing a molten salt electrolyte and a transition metal ion source. The electrode structure can be used for various applications such as electrochemical energy storage devices including high power and high-energy primary or secondary batteries.

The present disclosure generally relates to a method for electroplating (or electrodeposition) a transition metal oxide composition that may be used in gas sensors, biological cell sensors, supercapacitors, catalysts for fuel cells and metal air batteries, nano and optoelectronic devices, filtration devices, structural components, and energy storage devices. The method includes electrodepositing the electrochemically active transition metal oxide composition onto a working electrode in an electrodeposition bath containing a molten salt electrolyte and a transition metal ion source. The electrode structure can be used for various applications such as electrochemical energy storage devices including high power and high-energy primary or secondary batteries.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

The present disclosure disclose a method for preparing a heat dissipation component with high flexibility made of graphite or a graphene material, which includes that follow steps: 1) plasma cleaning a graphite or graphene raw material; 2) taking preparation materials of an activator; 3) continually cleaning the graphite or graphene raw material with the activator; 4) cleaning the graphite or graphene raw material with deionized water; 5) conducting a electroplating process on a surface of the graphite or graphene raw material to form a copper film layer; 6) continually cleaning the graphite or graphene raw material; 7) forming a protective film on the graphite or graphene raw material by soaking; 8) drying the graphite or graphene raw material electroplated with the copper film layer. The surface of graphite or graphene treated with the activator has a uniform copper film layer with good binding quality during electroplating.

The present disclosure disclose a method for preparing a heat dissipation component with high flexibility made of graphite or a graphene material, which includes that follow steps: 1) plasma cleaning a graphite or graphene raw material; 2) taking preparation materials of an activator; 3) continually cleaning the graphite or graphene raw material with the activator; 4) cleaning the graphite or graphene raw material with deionized water; 5) conducting a electroplating process on a surface of the graphite or graphene raw material to form a copper film layer; 6) continually cleaning the graphite or graphene raw material; 7) forming a protective film on the graphite or graphene raw material by soaking; 8) drying the graphite or graphene raw material electroplated with the copper film layer. The surface of graphite or graphene treated with the activator has a uniform copper film layer with good binding quality during electroplating.