In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

An exemplary RF module includes a dielectric substrate with metal traces on one surface that connect high frequency components and provide reference ground. Other metal traces on the other surface of the substrate also provide high frequency transmission lines and reference ground. An enclosure made using semiconductor manufacturing technology is mounted to the substrate and has conductive interior recesses defined by extending walls that are connected to the reference ground. The recesses surround the respective components and provide electromagnetic shielding. The dimensional precision in the location and smoothness of the walls and recesses due to the semiconductor manufacturing technology provides repeatable unit-to-unit RF characteristics of the RF module. One way of mounting the enclosure to the substrate uses a plurality of metal bonding bumps extending outwardly from the walls to engage reference ground metal traces on the substrate. Applied pressure deforms the bonding bumps to form a metal-to-metal bond.

An exemplary RF module includes a dielectric substrate with metal traces on one surface that connect high frequency components and provide reference ground. Other metal traces on the other surface of the substrate also provide high frequency transmission lines and reference ground. An enclosure made using semiconductor manufacturing technology is mounted to the substrate and has conductive interior recesses defined by extending walls that are connected to the reference ground. The recesses surround the respective components and provide electromagnetic shielding. The dimensional precision in the location and smoothness of the walls and recesses due to the semiconductor manufacturing technology provides repeatable unit-to-unit RF characteristics of the RF module. One way of mounting the enclosure to the substrate uses a plurality of metal bonding bumps extending outwardly from the walls to engage reference ground metal traces on the substrate. Applied pressure deforms the bonding bumps to form a metal-to-metal bond.

The present invention is directed to an electrodepositable coating composition comprising an electrodepositable binder comprising an ionic salt group-containing film-forming polymer comprising active hydrogen functional groups, and a blocked polyisocyanate curing agent; a solubilized bismuth catalyst; and a guanidine; wherein the electrodepositable coating composition has a weight ratio of bismuth metal from the solubilized bismuth catalyst to guanidine of from 1.00:0.071 to 1.0:2.1 and/or a molar ratio of bismuth metal to guanidine of from 1.0:0.25 to 1.0:3.0. Also disclosed are methods of treating electrodepositable coating compositions, methods for making electrodepositable coating compositions, systems for coating a metal substrate, coatings, coated substrates, and methods of coating a substrate.

The present invention is directed to an electrodepositable coating composition comprising an electrodepositable binder comprising an ionic salt group-containing film-forming polymer comprising active hydrogen functional groups, and a blocked polyisocyanate curing agent; a solubilized bismuth catalyst; and a guanidine; wherein the electrodepositable coating composition has a weight ratio of bismuth metal from the solubilized bismuth catalyst to guanidine of from 1.00:0.071 to 1.0:2.1 and/or a molar ratio of bismuth metal to guanidine of from 1.0:0.25 to 1.0:3.0. Also disclosed are methods of treating electrodepositable coating compositions, methods for making electrodepositable coating compositions, systems for coating a metal substrate, coatings, coated substrates, and methods of coating a substrate.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

An assembly that includes a first substrate formed of aluminum or an aluminum alloy; and a second substrate formed of a polymer composite that includes a plurality of carbon fibers. The second substrate is joined to the first substrate in a manner where a surface of exposed carbon fibers contacts the aluminum or aluminum alloy of the first substrate; and an is adlayer formed on the surface of the exposed carbon fibers that is configured to inhibit galvanic corrosion of the first substrate, corrosion of the carbon fibers, and debonding of the polymer of the composite from the carbon fibers upon formation of a galvanic couple between the first substrate and the second substrate.

An assembly that includes a first substrate formed of aluminum or an aluminum alloy; and a second substrate formed of a polymer composite that includes a plurality of carbon fibers. The second substrate is joined to the first substrate in a manner where a surface of exposed carbon fibers contacts the aluminum or aluminum alloy of the first substrate; and an is adlayer formed on the surface of the exposed carbon fibers that is configured to inhibit galvanic corrosion of the first substrate, corrosion of the carbon fibers, and debonding of the polymer of the composite from the carbon fibers upon formation of a galvanic couple between the first substrate and the second substrate.