An article including a glass or glass ceramic substrate, a noble metal layer, an adhesion promoting layer positioned between and bonded to the substrate and the noble metal layer, and a conductive metal layer positioned on and bonded to the noble metal layer. The adhesion promoting layer includes a siloxy group bonded with the substrate and a thiol group bonded to the noble metal layer. A method for manufacturing an article including applying an adhesion promoting layer comprising mercaptosilane to at least a portion of a glass or glass ceramic substrate, wherein siloxane bonds are formed between the mercaptosilane and the substrate, applying a noble metal layer to the adhesion promoting layer, the noble metal layer bonds with a thiol present in the mercaptosilane, thermally treating the noble metal layer, and applying a conductive metal layer to the noble metal layer.

The present subject matter relates generally to the derivatization of highly-aligned carbon nanotube sheet substrates with one or more transition metal centers and to uses of the resulting metal-derivatized CNT sheet substrates.

The present subject matter relates generally to the derivatization of highly-aligned carbon nanotube sheet substrates with one or more transition metal centers and to uses of the resulting metal-derivatized CNT sheet substrates.

A partial plating method of an automobile resin part may include a painting step of partially applying masking paint for plating on one side surface of an injection molded automobile resin product to form a painting portion where the masking paint for plating is applied and a non-painting portion where the masking paint for plating is not applied, and a wet electroplating step of attaching a current electrode for wet electroplating on the non-painting portion and performing the wet electroplating to form a plating layer on the entire surface of the automobile resin part except for the painting portion.

A method for manufacturing a copper composite electrode, including contacting a conductive substrate including copper with a phosphate solution for oxidation to produce a copper phosphate structure on a surface of the conductive substrate, thus acquiring a copper phosphate composite electrode.

A method for manufacturing a copper composite electrode, including contacting a conductive substrate including copper with a phosphate solution for oxidation to produce a copper phosphate structure on a surface of the conductive substrate, thus acquiring a copper phosphate composite electrode.

Provided is a method of manufacturing a nano-catalyst filter, which includes depositing through electrodeposition a catalyst precursor inside a porous filter to which an electrode layer is attached. Using this method, a nano-catalyst can be uniformly deposited inside a porous ceramic filter, and high catalyst efficiency can be obtained only using a small amount of the nano-catalyst.

A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.

A method of forming a solderable solder deposit on a contact pad, comprising the steps of providing an organic, non-conductive substrate which exposes said contact pad under an opening of a first non-conductive resist layer, depositing a conductive layer inside and outside the opening such that an activated surface results, thereby forming an activated opening, electrolytically depositing nickel or nickel alloy into the activated opening such that nickel/nickel alloy is deposited onto the activated surface, electrolytically depositing tin or tin alloy onto the nickel/nickel alloy, with the proviso that the electrolytic deposition of later steps results in an entirely filled activated opening, wherein the entirely filled activated opening is completely filled with said nickel/nickel alloy, or in the entirely filled activated opening the total volume of nickel/nickel alloy is higher than the total volume of tin and tin alloy, based on the total volume of the entirely filled activated opening.

A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.