A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

Aspects of the disclosure include copper-graphene (Cu-Gr) multilayer composite (CGMC) current collectors and methods of manufacturing the same. An exemplary vehicle includes an electric motor and a battery pack electrically coupled to the electric motor. The battery pack includes a battery cell with a cell pouch having therein a plurality of stacked anode current collectors alternating with a plurality of stacked cathode current collectors, and an active material dispersed within the cell pouch to cover the current collectors. Each of the anode current collectors is a CGMC current collector including a copper foil substrate having a top surface and a bottom surface. The copper foil substrate is pure copper. A graphene layer is directly on at least one of the top surface and the bottom surface of the copper foil substrate and a plated copper layer is directly on the graphene layer.

Aspects of the disclosure include copper-graphene (Cu-Gr) multilayer composite (CGMC) current collectors and methods of manufacturing the same. An exemplary vehicle includes an electric motor and a battery pack electrically coupled to the electric motor. The battery pack includes a battery cell with a cell pouch having therein a plurality of stacked anode current collectors alternating with a plurality of stacked cathode current collectors, and an active material dispersed within the cell pouch to cover the current collectors. Each of the anode current collectors is a CGMC current collector including a copper foil substrate having a top surface and a bottom surface. The copper foil substrate is pure copper. A graphene layer is directly on at least one of the top surface and the bottom surface of the copper foil substrate and a plated copper layer is directly on the graphene layer.

The present application relates to the processing field of circuit boards. Disclosed are a method for plating edge connectors on a circuit board with gold, and a circuit board. The method comprises the following steps: filling gaps between edge connectors on a circuit board with a conductive medium, wherein the height of the conductive medium is greater than the height of each edge connector; enabling a tip of a first probe to be tangent to an upper surface of the conductive medium, and placing a tip of a second probe above the edge connector, wherein the tip of the second probe and the tip of the first probe are located in the same horizontal plane; connecting the first probe and the second probe to a loop on/off detection device; plating an upper surface of the edge connector with gold, and stopping gold plating when the loop on/off detection device detects the connection of a loop; and removing the conductive medium. In the present application, the gaps between the edge connectors are filled with the conductive medium, the height of which is greater than that of the edge connector, the tip of the first probe is tangent to the upper surface of the conductive medium, the tip of the second probe is flush with the tip of the first probe, and gold plating is stopped when each gold-plated layer comes into contact with the tip of the second probe, such that the gold-plated layers on all the edge connectors are equal in thickness; and there is no need to manufacture a lead wire.

The present application relates to the processing field of circuit boards. Disclosed are a method for plating edge connectors on a circuit board with gold, and a circuit board. The method comprises the following steps: filling gaps between edge connectors on a circuit board with a conductive medium, wherein the height of the conductive medium is greater than the height of each edge connector; enabling a tip of a first probe to be tangent to an upper surface of the conductive medium, and placing a tip of a second probe above the edge connector, wherein the tip of the second probe and the tip of the first probe are located in the same horizontal plane; connecting the first probe and the second probe to a loop on/off detection device; plating an upper surface of the edge connector with gold, and stopping gold plating when the loop on/off detection device detects the connection of a loop; and removing the conductive medium. In the present application, the gaps between the edge connectors are filled with the conductive medium, the height of which is greater than that of the edge connector, the tip of the first probe is tangent to the upper surface of the conductive medium, the tip of the second probe is flush with the tip of the first probe, and gold plating is stopped when each gold-plated layer comes into contact with the tip of the second probe, such that the gold-plated layers on all the edge connectors are equal in thickness; and there is no need to manufacture a lead wire.

Methods for producing a conductive element precursor and a conductive element, such as a tape or wire, are provided. The methods comprise growing a plurality of carbon nanotubes on a metallic substrate and coating carbon nanotubes of the plurality of carbon nanotubes on the metallic substrate with a metallic material.

Methods for producing a conductive element precursor and a conductive element, such as a tape or wire, are provided. The methods comprise growing a plurality of carbon nanotubes on a metallic substrate and coating carbon nanotubes of the plurality of carbon nanotubes on the metallic substrate with a metallic material.

The present invention is directed to an electrodepositable coating composition comprising an electrodepositable binder comprising an ionic salt group-containing film-forming polymer comprising active hydrogen functional groups, and a blocked polyisocyanate curing agent; a solubilized bismuth catalyst; and a guanidine; wherein the electrodepositable coating composition has a weight ratio of bismuth metal from the solubilized bismuth catalyst to guanidine of from 1.00:0.071 to 1.0:2.1 and/or a molar ratio of bismuth metal to guanidine of from 1.0:0.25 to 1.0:3.0. Also disclosed are methods of treating electrodepositable coating compositions, methods for making electrodepositable coating compositions, systems for coating a metal substrate, coatings, coated substrates, and methods of coating a substrate.

The present invention is directed to an electrodepositable coating composition comprising an electrodepositable binder comprising an ionic salt group-containing film-forming polymer comprising active hydrogen functional groups, and a blocked polyisocyanate curing agent; a solubilized bismuth catalyst; and a guanidine; wherein the electrodepositable coating composition has a weight ratio of bismuth metal from the solubilized bismuth catalyst to guanidine of from 1.00:0.071 to 1.0:2.1 and/or a molar ratio of bismuth metal to guanidine of from 1.0:0.25 to 1.0:3.0. Also disclosed are methods of treating electrodepositable coating compositions, methods for making electrodepositable coating compositions, systems for coating a metal substrate, coatings, coated substrates, and methods of coating a substrate.