Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall surfaces. The methods may further include forming a nanotwin-containing metal material in the at least one opening. The metal material may be formed by two or more cycles that include delivering a forward current from a power supply through the plating bath of the electroplating chamber for a first period of time, plating a first amount of the metal on the bottom surface of the opening on the patterned substrate and a second amount of the metal on the sidewall surfaces of the opening, and delivering a reverse current from the power supply through the plating bath of the electroplating chamber to remove some of the metal plated in the opening on the patterned substrate.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

Methods for producing a conductive element precursor and a conductive element, such as a tape or wire, are provided. The methods comprise growing a plurality of carbon nanotubes on a metallic substrate and coating carbon nanotubes of the plurality of carbon nanotubes on the metallic substrate with a metallic material.

Methods for producing a conductive element precursor and a conductive element, such as a tape or wire, are provided. The methods comprise growing a plurality of carbon nanotubes on a metallic substrate and coating carbon nanotubes of the plurality of carbon nanotubes on the metallic substrate with a metallic material.

The invention relates to a heat management structure with graphene and copper, and a formation method thereof, comprising a copper foil layer provided, then forming a graphene layer on the copper foil layer surface, and forming an electroplating copper layer on the graphene layer surface, and eventually forming an electroplating copper layer-graphene layer-copper foil layer sandwich heat management structure.

The invention relates to a heat management structure with graphene and copper, and a formation method thereof, comprising a copper foil layer provided, then forming a graphene layer on the copper foil layer surface, and forming an electroplating copper layer on the graphene layer surface, and eventually forming an electroplating copper layer-graphene layer-copper foil layer sandwich heat management structure.

A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas formed on surface, and forming a build-up part including conductor layers and insulating layers on the surface of the substrate across the product areas. The product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that each insulating layer has elongation rate of 7% or more, the laminating the conductor layers includes forming a resist layer having a resist pattern and forming a conductor pattern including wirings according to the pattern such that the wirings have minimum width of 2 m or less and minimum inter-wiring distance of 2 m or less, and the forming the resist includes exposing the resist by direct imaging exposure.

A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas formed on surface, and forming a build-up part including conductor layers and insulating layers on the surface of the substrate across the product areas. The product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that each insulating layer has elongation rate of 7% or more, the laminating the conductor layers includes forming a resist layer having a resist pattern and forming a conductor pattern including wirings according to the pattern such that the wirings have minimum width of 2 m or less and minimum inter-wiring distance of 2 m or less, and the forming the resist includes exposing the resist by direct imaging exposure.

A method for prelithiating a soft carbon negative electrode includes the steps of: disposing the soft carbon negative electrode and a lithium metal piece spaced apart from each other with a lithium-containing electrolyte present therebetween; prelithiating the soft carbon negative electrode at a first constant C-rate until a voltage thereof is reduced to a first predetermined voltage not greater than 0.3 V vs. Li/Li.sup.+, the first constant C-rate being not greater than 5 C; prelithiating the soft carbon negative electrode at a second constant C-rate until the voltage thereof is reduced to a second predetermined voltage lower than the first predetermined voltage, the second constant C-rate being not greater than 0.2 C and being less than the first constant C-rate; and prelithiating the soft carbon negative electrode at a prelithiation constant voltage which is not greater than the second predetermined voltage, thereby completing prelithiation of the soft carbon negative electrode.