A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a root mean square gradient of roughness curve elements RΔq according to JIS B0601:2013 of 5 to 28°. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

A metallized plastic component includes a base body of at least one light-permeable plastic to which a metal layer is applied into which at least one illuminatable structure is introduced. The at least one illuminatable structure is formed by an area in the metal layer in which a plurality of light-permeable openings is arranged in a dot matrix.

The threaded connection for pipes includes a pin, a box and a Zn—Ni alloy plating layer. The pin has a pin-side contact surface that includes a pin-side thread part. The box has a box-side contact surface that includes a box-side thread part. The Zn—Ni alloy plating layer is formed on at least one of the pin-side contact surface and the box-side contact surface. The Zn—Ni alloy plating layer is consisting of Zn, Ni, trace amount of Cr and impurities. The trace amount of Cr content of the Zn—Ni alloy plating layer is 5.0×10 counts/sec or more in terms of Cr intensity as measured by secondary ion mass spectrometry using O.sub.2.sup.+ ions as bombarding ions.

Methods for electrodeposition using aqueous electrolytes where water molecules are depleted are described herein. Methods of electrodepositing superconducting thin films from aqueous electrolytes where water molecules are depleted are also described herein.

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

The present invention relates to a method for increasing the corrosion resistance of a chrome-plated substrate wherein at least one part of a chrome-plated surface of a chrome-plated substrate is dipped into an electrolyte comprising trivalent chromium ions, at least one conducting salt and at least one reducing agent, and afterwards, a trivalent chromium oxide film is formed on the at least one part of the chrome-plated surface by applying a pulse reverse current between the chrome-plated surface and a counter electrode electrically connected with the chrome-plated surface through the electrolyte. Furthermore, the present invention relates to a chrome-plated substrate obtainable by this method.

An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate.

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 μg/dm.sup.2 and a Zn deposited amount of 20 to 1,000 μg/dm.sup.2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

A steel sheet for can making and methods for manufacturing the same. The steel sheet includes, in order from a steel sheet side, an iron-nickel diffusion layer, a metallic chromium layer, and a chromium oxide layer. The iron-nickel diffusion layer has a nickel coating weight of 50 mg/m.sup.2 to 500 mg/m.sup.2 per surface of the steel sheet and a thickness of 0.060 μm to 0.500 μm per surface of the steel sheet. The metallic chromium layer includes a flat-like metallic chromium sublayer and a granular metallic chromium sublayer placed on a surface of the flat-like metallic chromium sublayer. The total chromium coating weight of both sublayers per surface of the steel sheet is 60 mg/m.sup.2 to 200 mg/m.sup.2. The chromium oxide layer has a chromium coating weight 3 mg/m.sup.2 to 10 mg/m.sup.2 per surface of the steel sheet in terms of metallic chromium.